- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
Patent holdings for IPC class H01L 23/433
Total number of patents in this class: 1046
10-year publication summary
|
95
|
64
|
109
|
120
|
96
|
71
|
58
|
45
|
72
|
39
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42461 |
61 |
| Mitsubishi Electric Corporation | 45962 |
51 |
| Denso Corporation | 24230 |
47 |
| Intel Corporation | 46949 |
42 |
| Semiconductor Components Industries, L.L.C. | 5253 |
38 |
| Infineon Technologies AG | 8213 |
37 |
| Samsung Electronics Co., Ltd. | 145416 |
32 |
| Rohm Co., Ltd. | 6428 |
25 |
| Fuji Electric Co., Ltd. | 5129 |
20 |
| Robert Bosch GmbH | 42632 |
19 |
| Hitachi Astemo, Ltd. | 6387 |
18 |
| Raytheon Company | 8396 |
16 |
| Micron Technology, Inc. | 26231 |
15 |
| International Business Machines Corporation | 61207 |
14 |
| NXP USA, Inc. | 4299 |
14 |
| Frore Systems Inc. | 101 |
14 |
| Toyota Motor Corporation | 31819 |
13 |
| Infineon Technologies Austria AG | 2143 |
13 |
| Mediatek Inc. | 5099 |
12 |
| General Electric Company | 13811 |
10 |
| Other owners | 535 |