- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
Patent holdings for IPC class H01L 23/44
Total number of patents in this class: 248
10-year publication summary
|
25
|
20
|
14
|
21
|
11
|
24
|
23
|
39
|
33
|
9
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| OVH | 291 |
12 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48438 |
11 |
| Intel Corporation | 47122 |
9 |
| Fujitsu Limited | 16883 |
8 |
| MTS IP Holdings Ltd | 66 |
8 |
| Infineon Technologies AG | 8402 |
7 |
| Semiconductor Components Industries, L.L.C. | 5263 |
7 |
| Northrop Grumman Systems Corporation | 2913 |
7 |
| Microsoft Technology Licensing, LLC | 54463 |
7 |
| International Business Machines Corporation | 62671 |
6 |
| Mitsubishi Heavy Industries, Ltd. | 9139 |
6 |
| Modine LLC | 51 |
5 |
| Micron Technology, Inc. | 27675 |
4 |
| ExaScaler Inc. | 34 |
4 |
| YASA Limited | 61 |
4 |
| SLICIP, Inc. | 9 |
4 |
| NEC Corporation | 37005 |
3 |
| Oracle International Corporation | 13575 |
3 |
| Hamilton Sundstrand Corporation | 5014 |
3 |
| Samsung Electronics Co., Ltd. | 157946 |
2 |
| Other owners | 128 |