- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
Patent holdings for IPC class H01L 23/473
Total number of patents in this class: 3409
10-year publication summary
|
242
|
256
|
245
|
286
|
223
|
241
|
259
|
339
|
331
|
60
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fuji Electric Co., Ltd. | 5359 |
137 |
| International Business Machines Corporation | 62076 |
115 |
| Denso Corporation | 25074 |
108 |
| Mitsubishi Electric Corporation | 47461 |
104 |
| Intel Corporation | 46625 |
90 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46877 |
70 |
| Hitachi Astemo, Ltd. | 6389 |
68 |
| Toyota Motor Corporation | 34214 |
58 |
| Adeia Semiconductor Bonding Technologies Inc. | 538 |
56 |
| Semiconductor Components Industries, L.L.C. | 5274 |
48 |
| BorgWarner US Technologies LLC | 440 |
44 |
| Robert Bosch GmbH | 43428 |
41 |
| Siemens AG | 24314 |
38 |
| Mitsubishi Materials Corporation | 2467 |
37 |
| Fujitsu Limited | 17247 |
35 |
| Rohm Co., Ltd. | 6711 |
34 |
| TOYOTA JIDOSHA KABUSHIKI KAISHA (also trading as TOYOTA MOTOR CORPORATION) | 12560 |
33 |
| Nidec Corporation | 2744 |
32 |
| Samsung Electronics Co., Ltd. | 152534 |
31 |
| Raytheon Company | 8474 |
29 |
| Other owners | 2201 |