- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
Patent holdings for IPC class H01L 23/473
Total number of patents in this class: 3323
10-year publication summary
|
279
|
242
|
256
|
245
|
286
|
222
|
239
|
255
|
333
|
298
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fuji Electric Co., Ltd. | 5242 |
132 |
| International Business Machines Corporation | 61738 |
114 |
| Denso Corporation | 24729 |
106 |
| Mitsubishi Electric Corporation | 46814 |
103 |
| Intel Corporation | 46455 |
89 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 45590 |
66 |
| Hitachi Astemo, Ltd. | 6367 |
65 |
| Toyota Motor Corporation | 33341 |
58 |
| Adeia Semiconductor Bonding Technologies Inc. | 396 |
50 |
| Semiconductor Components Industries, L.L.C. | 5301 |
45 |
| BorgWarner US Technologies LLC | 435 |
39 |
| Robert Bosch GmbH | 43001 |
38 |
| Siemens AG | 24342 |
37 |
| Mitsubishi Materials Corporation | 2472 |
37 |
| Fujitsu Limited | 17675 |
35 |
| TOYOTA JIDOSHA KABUSHIKI KAISHA (also trading as TOYOTA MOTOR CORPORATION) | 12686 |
34 |
| Rohm Co., Ltd. | 6544 |
32 |
| Nidec Corporation | 2698 |
32 |
| Raytheon Company | 8391 |
28 |
| Infineon Technologies AG | 8277 |
26 |
| Other owners | 2157 |