- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
Patent holdings for IPC class H01L 23/482
Total number of patents in this class: 967
10-year publication summary
|
89
|
91
|
104
|
91
|
91
|
84
|
70
|
66
|
71
|
2
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40539 |
66 |
| Semiconductor Components Industries, L.L.C. | 5242 |
46 |
| Infineon Technologies AG | 8134 |
33 |
| Rohm Co., Ltd. | 6314 |
33 |
| Intel Corporation | 46097 |
28 |
| Samsung Electronics Co., Ltd. | 138518 |
21 |
| Renesas Electronics Corporation | 6155 |
21 |
| Mitsubishi Electric Corporation | 44738 |
21 |
| Toshiba Corporation | 12037 |
18 |
| Texas Instruments Incorporated | 19405 |
17 |
| Qualcomm Incorporated | 81413 |
15 |
| Micron Technology, Inc. | 25756 |
14 |
| Infineon Technologies Americas Corp. | 730 |
14 |
| Fuji Electric Co., Ltd. | 4956 |
13 |
| Murata Manufacturing Co., Ltd. | 23648 |
12 |
| Cree, Inc. | 1067 |
12 |
| Skyworks Solutions, Inc. | 3603 |
12 |
| NXP USA, Inc. | 4214 |
12 |
| Wolfspeed, Inc. | 630 |
12 |
| Samsung Display Co., Ltd. | 32700 |
11 |
| Other owners | 536 |