- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Patent holdings for IPC class H01L 23/538
Total number of patents in this class: 11948
10-year publication summary
|
622
|
816
|
1020
|
1178
|
1116
|
1156
|
1086
|
1338
|
1481
|
467
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47211 |
2369 |
| Samsung Electronics Co., Ltd. | 153573 |
1179 |
| Intel Corporation | 46638 |
1179 |
| Qualcomm Incorporated | 90109 |
332 |
| Advanced Semiconductor Engineering, Inc. | 1701 |
272 |
| Micron Technology, Inc. | 27266 |
259 |
| STATS ChipPAC Pte. Lte. | 981 |
140 |
| Amkor Technology Singapore Holding Pte. Ltd | 462 |
137 |
| Infineon Technologies AG | 8383 |
134 |
| International Business Machines Corporation | 62182 |
130 |
| Murata Manufacturing Co., Ltd. | 25506 |
121 |
| Apple Inc. | 58049 |
118 |
| Mediatek Inc. | 5388 |
118 |
| Samsung Electro-mechanics Co., Ltd. | 5833 |
102 |
| Adeia Semiconductor Technologies LLC | 585 |
101 |
| Siliconware Precision Industries Co., Ltd. | 663 |
99 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 357 |
89 |
| SK Hynix Inc. | 12134 |
87 |
| Fuji Electric Co., Ltd. | 5383 |
86 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 528 |
82 |
| Other owners | 4814 |