- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Patent holdings for IPC class H01L 23/538
Total number of patents in this class: 11138
10-year publication summary
|
615
|
621
|
816
|
1020
|
1178
|
1115
|
1150
|
1066
|
1321
|
1175
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43628 |
2227 |
| Intel Corporation | 47221 |
1170 |
| Samsung Electronics Co., Ltd. | 147787 |
1013 |
| Qualcomm Incorporated | 86648 |
302 |
| Advanced Semiconductor Engineering, Inc. | 1668 |
261 |
| Micron Technology, Inc. | 26235 |
228 |
| STATS ChipPAC Pte. Lte. | 1552 |
181 |
| Infineon Technologies AG | 8255 |
131 |
| Amkor Technology Singapore Holding Pte. Ltd | 421 |
128 |
| International Business Machines Corporation | 61537 |
127 |
| Murata Manufacturing Co., Ltd. | 24813 |
117 |
| Mediatek Inc. | 5173 |
114 |
| Apple Inc. | 55491 |
112 |
| Samsung Electro-mechanics Co., Ltd. | 5664 |
101 |
| Invensas Corporation | 613 |
90 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 361 |
89 |
| Siliconware Precision Industries Co., Ltd. | 610 |
87 |
| Fuji Electric Co., Ltd. | 5206 |
80 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 510 |
80 |
| SK Hynix Inc. | 11498 |
79 |
| Other owners | 4421 |