- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
Patent holdings for IPC class H01L 25/065
Total number of patents in this class: 17961
10-year publication summary
|
1147
|
1245
|
1313
|
1415
|
1458
|
1568
|
1709
|
1910
|
2290
|
2027
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44282 |
3043 |
| Samsung Electronics Co., Ltd. | 148173 |
2230 |
| Intel Corporation | 46937 |
1389 |
| Micron Technology, Inc. | 26317 |
1002 |
| SK Hynix Inc. | 11558 |
418 |
| Kioxia Corporation | 10440 |
392 |
| Qualcomm Incorporated | 87067 |
342 |
| International Business Machines Corporation | 61621 |
288 |
| Invensas Corporation | 613 |
227 |
| Yangtze Memory Technologies Co., Ltd. | 2831 |
202 |
| Advanced Semiconductor Engineering, Inc. | 1671 |
194 |
| Sandisk Technologies Inc. | 4892 |
189 |
| Murata Manufacturing Co., Ltd. | 24861 |
168 |
| STATS ChipPAC Pte. Lte. | 1548 |
159 |
| Nanya Technology Corporation | 2601 |
158 |
| Advanced Micro Devices, Inc. | 5781 |
146 |
| Xilinx, Inc. | 3963 |
142 |
| Infineon Technologies AG | 8266 |
130 |
| Sony Semiconductor Solutions Corporation | 10722 |
129 |
| Adeia Semiconductor Bonding Technologies Inc. | 389 |
127 |
| Other owners | 6886 |