- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
Patent holdings for IPC class H01L 25/065
Total number of patents in this class: 18938
10-year publication summary
|
1245
|
1313
|
1415
|
1458
|
1571
|
1720
|
1928
|
2293
|
2511
|
482
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46877 |
3282 |
| Samsung Electronics Co., Ltd. | 152534 |
2357 |
| Intel Corporation | 46625 |
1357 |
| Micron Technology, Inc. | 27235 |
1063 |
| SK Hynix Inc. | 12014 |
446 |
| Kioxia Corporation | 10680 |
428 |
| Qualcomm Incorporated | 89428 |
398 |
| International Business Machines Corporation | 62076 |
307 |
| Yangtze Memory Technologies Co., Ltd. | 3097 |
220 |
| Sandisk Technologies Inc. | 5317 |
218 |
| Adeia Semiconductor Technologies LLC | 486 |
210 |
| Advanced Semiconductor Engineering, Inc. | 1693 |
202 |
| Adeia Semiconductor Bonding Technologies Inc. | 538 |
179 |
| Nanya Technology Corporation | 2797 |
175 |
| Murata Manufacturing Co., Ltd. | 25356 |
174 |
| Advanced Micro Devices, Inc. | 5914 |
158 |
| Xilinx, Inc. | 3929 |
144 |
| Infineon Technologies AG | 8343 |
130 |
| Sony Semiconductor Solutions Corporation | 11123 |
130 |
| Apple Inc. | 57505 |
129 |
| Other owners | 7231 |