• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 25/11 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass

Patent holdings for IPC class H01L 25/11

Total number of patents in this class: 841

10-year publication summary

92
108
104
77
39
48
40
46
52
41
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
48490
91
Samsung Electronics Co., Ltd.
158156
39
Intel Corporation
47100
38
Mitsubishi Electric Corporation
48097
27
Denso Corporation
25607
23
Murata Manufacturing Co., Ltd.
25776
20
Fuji Electric Co., Ltd.
5498
19
Siemens AG
24011
18
Rohm Co., Ltd.
6843
16
Semiconductor Components Industries, L.L.C.
5261
16
Infineon Technologies Americas Corp.
1938
16
ABB Schweiz AG
7640
15
Infineon Technologies AG
8405
13
Micron Technology, Inc.
27709
11
Qualcomm Incorporated
92563
10
International Business Machines Corporation
62672
10
Institut VEDECOM
62
10
Adeia Semiconductor Technologies LLC
592
9
Sony Corporation
30139
8
Hitachi Energy Ltd.
2593
8
Other owners 424