- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/11 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass
Patent holdings for IPC class H01L 25/11
Total number of patents in this class: 805
10-year publication summary
|
66
|
92
|
108
|
104
|
77
|
40
|
46
|
39
|
48
|
30
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42804 |
78 |
| Intel Corporation | 47005 |
37 |
| Samsung Electronics Co., Ltd. | 146346 |
26 |
| Mitsubishi Electric Corporation | 46127 |
25 |
| Denso Corporation | 24316 |
24 |
| Murata Manufacturing Co., Ltd. | 24542 |
20 |
| Micron Technology, Inc. | 26238 |
19 |
| Fuji Electric Co., Ltd. | 5148 |
19 |
| Siemens AG | 24477 |
16 |
| Semiconductor Components Industries, L.L.C. | 5249 |
16 |
| ABB Schweiz AG | 6976 |
16 |
| Infineon Technologies Americas Corp. | 674 |
16 |
| Rohm Co., Ltd. | 6459 |
15 |
| Infineon Technologies AG | 8225 |
12 |
| Invensas Corporation | 613 |
12 |
| International Business Machines Corporation | 61257 |
11 |
| Institut VEDECOM | 62 |
10 |
| Sony Corporation | 31036 |
8 |
| Hitachi Energy Ltd. | 2227 |
8 |
| Dynex Semiconductor Limited | 66 |
7 |
| Other owners | 410 |