- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/11 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group
Patent holdings for IPC class H01L 25/11
Total number of patents in this class: 780
10-year publication summary
|
66
|
92
|
108
|
103
|
77
|
40
|
43
|
39
|
47
|
2
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40608 |
69 |
| Intel Corporation | 46126 |
36 |
| Samsung Electronics Co., Ltd. | 139001 |
25 |
| Denso Corporation | 23769 |
24 |
| Mitsubishi Electric Corporation | 44851 |
24 |
| Micron Technology, Inc. | 25824 |
19 |
| Murata Manufacturing Co., Ltd. | 23702 |
18 |
| Fuji Electric Co., Ltd. | 4980 |
18 |
| Siemens AG | 24565 |
16 |
| Infineon Technologies Americas Corp. | 725 |
16 |
| Rohm Co., Ltd. | 6346 |
15 |
| Semiconductor Components Industries, L.L.C. | 5246 |
15 |
| ABB Schweiz AG | 6632 |
15 |
| Infineon Technologies AG | 8137 |
12 |
| Invensas Corporation | 621 |
12 |
| International Business Machines Corporation | 60129 |
11 |
| Institut VEDECOM | 62 |
10 |
| Sony Corporation | 31541 |
8 |
| Hitachi Energy Ltd. | 2232 |
8 |
| Dynex Semiconductor Limited | 60 |
7 |
| Other owners | 402 |