- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/22 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate using similar magnetic field effects
Patent holdings for IPC class H01L 27/22
Total number of patents in this class: 3677
10-year publication summary
|
364
|
399
|
430
|
597
|
667
|
429
|
187
|
137
|
29
|
2
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 148077 |
395 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44095 |
390 |
| Kioxia Corporation | 10441 |
280 |
| International Business Machines Corporation | 61616 |
276 |
| SK Hynix Inc. | 11536 |
176 |
| TDK Corporation | 6878 |
146 |
| Integrated Silicon Solutions, (Cayman) Inc. | 221 |
115 |
| United Microelectronics Corp. | 4264 |
113 |
| Intel Corporation | 46921 |
109 |
| GLOBALFOUNDRIES Singapore Pte. Ltd. | 816 |
96 |
| Everspin Technologies, Inc. | 493 |
95 |
| Micron Technology, Inc. | 26279 |
90 |
| Sony Corporation | 30901 |
88 |
| Qualcomm Incorporated | 86990 |
83 |
| Avalanche Technology, Inc. | 303 |
69 |
| Sandisk Technologies Inc. | 4885 |
47 |
| Toshiba Corporation | 12514 |
45 |
| Tohoku University | 2824 |
41 |
| Allegro Microsystems, LLC | 1361 |
33 |
| GLOBALFOUNDRIES U.S. Inc. | 6409 |
31 |
| Other owners | 959 |