- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/22 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate using similar magnetic field effects
Patent holdings for IPC class H01L 27/22
Total number of patents in this class: 3538
10-year publication summary
|
399
|
430
|
597
|
667
|
427
|
161
|
73
|
9
|
2
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 159298 |
381 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 49027 |
365 |
| Kioxia Corporation | 11022 |
272 |
| International Business Machines Corporation | 62847 |
246 |
| SK Hynix Inc. | 12717 |
173 |
| TDK Corporation | 7039 |
137 |
| Integrated Silicon Solutions, (Cayman) Inc. | 221 |
115 |
| United Microelectronics Corp. | 4530 |
106 |
| Intel Corporation | 46313 |
101 |
| GLOBALFOUNDRIES Singapore Pte. Ltd. | 889 |
96 |
| Micron Technology, Inc. | 27867 |
89 |
| Everspin Technologies, Inc. | 500 |
88 |
| Qualcomm Incorporated | 93712 |
83 |
| Sony Corporation | 30029 |
81 |
| Avalanche Technology, Inc. | 305 |
69 |
| Toshiba Corporation | 12732 |
45 |
| Sandisk Technologies Inc. | 5505 |
44 |
| Tohoku University | 3039 |
41 |
| Allegro Microsystems, LLC | 1429 |
33 |
| GLOBALFOUNDRIES U.S. Inc. | 6394 |
31 |
| Other owners | 942 |