- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/22 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate using similar magnetic field effects
Patent holdings for IPC class H01L 27/22
Total number of patents in this class: 3572
10-year publication summary
|
399
|
430
|
597
|
667
|
427
|
162
|
90
|
14
|
2
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 154751 |
387 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47602 |
370 |
| Kioxia Corporation | 10715 |
274 |
| International Business Machines Corporation | 62295 |
253 |
| SK Hynix Inc. | 12212 |
174 |
| TDK Corporation | 6818 |
138 |
| Integrated Silicon Solutions, (Cayman) Inc. | 221 |
115 |
| United Microelectronics Corp. | 4456 |
107 |
| Intel Corporation | 46718 |
102 |
| GLOBALFOUNDRIES Singapore Pte. Ltd. | 836 |
96 |
| Everspin Technologies, Inc. | 503 |
94 |
| Micron Technology, Inc. | 27348 |
90 |
| Sony Corporation | 30353 |
84 |
| Qualcomm Incorporated | 90674 |
83 |
| Avalanche Technology, Inc. | 304 |
69 |
| Toshiba Corporation | 12694 |
45 |
| Sandisk Technologies Inc. | 5394 |
44 |
| Tohoku University | 2921 |
41 |
| Allegro Microsystems, LLC | 1409 |
33 |
| GLOBALFOUNDRIES U.S. Inc. | 6397 |
31 |
| Other owners | 942 |