- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/08 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
Patent holdings for IPC class H01L 29/08
Total number of patents in this class: 12164
10-year publication summary
|
1244
|
1346
|
1295
|
1495
|
1368
|
1091
|
788
|
684
|
801
|
461
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43400 |
2172 |
| Samsung Electronics Co., Ltd. | 147622 |
823 |
| International Business Machines Corporation | 61471 |
801 |
| Samsung Display Co., Ltd. | 35269 |
560 |
| Intel Corporation | 47129 |
439 |
| GLOBALFOUNDRIES U.S. Inc. | 6415 |
410 |
| Fuji Electric Co., Ltd. | 5203 |
308 |
| LG Display Co., Ltd. | 13820 |
216 |
| United Microelectronics Corp. | 4249 |
212 |
| Infineon Technologies AG | 8255 |
206 |
| Texas Instruments Incorporated | 19445 |
193 |
| Boe Technology Group Co., Ltd. | 41547 |
184 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1758 |
138 |
| Infineon Technologies Austria AG | 2173 |
137 |
| Renesas Electronics Corporation | 5987 |
136 |
| Toshiba Corporation | 12502 |
135 |
| Micron Technology, Inc. | 26210 |
129 |
| Rohm Co., Ltd. | 6487 |
125 |
| Denso Corporation | 24480 |
105 |
| Mitsubishi Electric Corporation | 46449 |
104 |
| Other owners | 4631 |