- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 41/277 - Manufacturing multilayered piezo-electric or electrostrictive devices or parts thereof, e.g. by stacking piezo-electric bodies and electrodes by stacking bulk piezo-electric or electrostrictive bodies and electrodes
Patent holdings for IPC class H01L 41/277
Total number of patents in this class: 91
10-year publication summary
|
19
|
16
|
9
|
6
|
9
|
5
|
8
|
1
|
0
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 24950 |
11 |
| Seiko Epson Corporation | 19675 |
7 |
| Olympus Corporation | 13099 |
6 |
| Canon Inc. | 40926 |
4 |
| Kyocera Corporation | 14050 |
3 |
| Magnecomp Corporation | 202 |
3 |
| Ningbo Semiconductor International Corporation | 90 |
3 |
| Qualcomm Incorporated | 87362 |
2 |
| TDK Corporation | 6888 |
2 |
| NGK Insulators, Ltd. | 5134 |
2 |
| Florida State University Research Foundation, Inc. | 777 |
2 |
| NGK Ceramic Device Co., Ltd. | 14 |
2 |
| Vitesco Technologies GmbH | 2418 |
2 |
| Sonicmems (Zhengzhou) Technology Co.,Ltd. | 20 |
2 |
| Apple Inc. | 56170 |
1 |
| The Boeing Company | 20151 |
1 |
| FUJIFILM Corporation | 29775 |
1 |
| Robert Bosch GmbH | 43001 |
1 |
| Applied Materials, Inc. | 19173 |
1 |
| Infineon Technologies AG | 8277 |
1 |
| Other owners | 34 |