- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/07 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
Patent holdings for IPC class H05K 3/07
Total number of patents in this class: 23
10-year publication summary
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1
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0
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1
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1
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2
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3
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1
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5
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| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ibiden Co., Ltd. | 1678 |
2 |
| Advanced Semiconductor Engineering, Inc. | 1751 |
2 |
| Sumitomo Electric Printed Circuits, Inc. | 341 |
2 |
| General Electric Company | 13915 |
1 |
| LG Chem, Ltd. | 17950 |
1 |
| Honeywell International Inc. | 12776 |
1 |
| Sumitomo Electric Industries, Ltd. | 16448 |
1 |
| Intel Corporation | 47178 |
1 |
| Amosense Co., Ltd. | 503 |
1 |
| Arizona Board of Regents, a Body Corporate of The State of Arizona Acting for and on Behalf of Arizona State University | 269 |
1 |
| Cytec Industries Inc. | 408 |
1 |
| DST Innovations Limited | 28 |
1 |
| Honeywell Federal Manufacturing & Technologies, LLC | 347 |
1 |
| Linxens Holding | 248 |
1 |
| Quantum Global Technologies LLC | 22 |
1 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1031 |
1 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1732 |
1 |
| LX Semicon Co., Ltd. | 739 |
1 |
| Adeia Semiconductor Technologies LLC | 594 |
1 |
| Toppan Holdings Inc. | 929 |
1 |
| Other owners | 0 |