- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Patent holdings for IPC class H05K 3/18
Total number of patents in this class: 1489
10-year publication summary
|
132
|
123
|
132
|
128
|
83
|
110
|
95
|
108
|
77
|
6
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| FUJIFILM Corporation | 30106 |
58 |
| Sumitomo Electric Industries, Ltd. | 15994 |
55 |
| LG Innotek Co., Ltd. | 8075 |
44 |
| Hitachi Chemical Company, Ltd. | 2291 |
40 |
| Sumitomo Electric Printed Circuits, Inc. | 319 |
39 |
| Resonac Corporation | 3128 |
36 |
| Nitto Denko Corporation | 8420 |
34 |
| Ibiden Co., Ltd. | 1685 |
33 |
| DIC Corporation | 3890 |
25 |
| Samsung Electro-mechanics Co., Ltd. | 5769 |
21 |
| Avary Holding (Shenzhen) Co., Limited. | 320 |
21 |
| Intel Corporation | 46594 |
19 |
| Atotech Deutschland GmbH | 540 |
19 |
| Asahi Kasei Kabushiki Kaisha | 2746 |
18 |
| C. Uyemura & Co., Ltd. | 161 |
18 |
| HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 156 |
18 |
| Eastman Kodak Company | 2722 |
17 |
| Catlam LLC | 27 |
17 |
| Kyocera Corporation | 14199 |
16 |
| DuPont Electronic Materials International, LLC | 422 |
16 |
| Other owners | 925 |