- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/42 - Plated through-holes
Patent holdings for IPC class H05K 3/42
Total number of patents in this class: 1825
10-year publication summary
|
131
|
152
|
174
|
158
|
125
|
123
|
142
|
115
|
109
|
69
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ibiden Co., Ltd. | 1680 |
76 |
| Intel Corporation | 46292 |
48 |
| International Business Machines Corporation | 62805 |
43 |
| Samsung Electro-mechanics Co., Ltd. | 6162 |
42 |
| Avary Holding (Shenzhen) Co., Limited. | 330 |
42 |
| Shinko Electric Industries Co., Ltd. | 1246 |
38 |
| Unimicron Technology Corp. | 508 |
36 |
| Sumitomo Electric Industries, Ltd. | 16368 |
32 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 553 |
31 |
| HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 163 |
31 |
| Sumitomo Electric Printed Circuits, Inc. | 343 |
31 |
| LG Innotek Co., Ltd. | 8566 |
29 |
| Kyocera Corporation | 14451 |
25 |
| Murata Manufacturing Co., Ltd. | 25917 |
24 |
| Dell Products L.P. | 17206 |
20 |
| Sanmina Corporation | 187 |
20 |
| Samsung Electronics Co., Ltd. | 159029 |
19 |
| Catlam LLC | 28 |
18 |
| Huawei Technologies Co., Ltd. | 124837 |
17 |
| Amphenol Corporation | 780 |
17 |
| Other owners | 1186 |