- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/42 - Plated through-holes
Patent holdings for IPC class H05K 3/42
Total number of patents in this class: 1699
10-year publication summary
176
|
131
|
152
|
174
|
158
|
125
|
123
|
139
|
114
|
55
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Ibiden Co., Ltd. | 1734 |
75 |
Intel Corporation | 46751 |
50 |
International Business Machines Corporation | 61123 |
42 |
Shinko Electric Industries Co., Ltd. | 1207 |
40 |
Avary Holding (Shenzhen) Co., Limited. | 303 |
40 |
Samsung Electro-mechanics Co., Ltd. | 5529 |
39 |
Unimicron Technology Corp. | 463 |
35 |
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 145 |
31 |
Sumitomo Electric Industries, Ltd. | 15377 |
28 |
at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 487 |
28 |
Sumitomo Electric Printed Circuits, Inc. | 306 |
26 |
Murata Manufacturing Co., Ltd. | 24369 |
24 |
Kyocera Corporation | 13706 |
22 |
Sanmina Corporation | 189 |
20 |
Samsung Electronics Co., Ltd. | 144426 |
19 |
LG Innotek Co., Ltd. | 7552 |
18 |
Amphenol Corporation | 759 |
17 |
Atotech Deutschland GmbH | 559 |
17 |
MacDermid Enthone Inc. | 237 |
17 |
Catlam LLC | 27 |
17 |
Other owners | 1094 |