- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/42 - Plated through-holes
Patent holdings for IPC class H05K 3/42
Total number of patents in this class: 1643
10-year publication summary
|
176
|
131
|
152
|
174
|
158
|
125
|
121
|
137
|
114
|
3
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ibiden Co., Ltd. | 1735 |
74 |
| Intel Corporation | 46097 |
49 |
| International Business Machines Corporation | 60075 |
42 |
| Shinko Electric Industries Co., Ltd. | 1186 |
37 |
| Avary Holding (Shenzhen) Co., Limited. | 283 |
37 |
| Samsung Electro-mechanics Co., Ltd. | 5191 |
34 |
| Unimicron Technology Corp. | 449 |
32 |
| HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 130 |
29 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 458 |
27 |
| Sumitomo Electric Industries, Ltd. | 14929 |
24 |
| Murata Manufacturing Co., Ltd. | 23648 |
23 |
| Sumitomo Electric Printed Circuits, Inc. | 285 |
23 |
| Kyocera Corporation | 13327 |
20 |
| Sanmina Corporation | 190 |
20 |
| Samsung Electronics Co., Ltd. | 138518 |
19 |
| LG Innotek Co., Ltd. | 7213 |
18 |
| Atotech Deutschland GmbH | 566 |
18 |
| MacDermid Enthone Inc. | 234 |
17 |
| Catlam LLC | 27 |
17 |
| Huawei Technologies Co., Ltd. | 106498 |
16 |
| Other owners | 1067 |