- All sections
- H - Electricity
- H10B - Electronic memory devices
- H10B 63/00 - Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
Patent holdings for IPC class H10B 63/00
Total number of patents in this class: 1461
10-year publication summary
1
|
0
|
0
|
1
|
18
|
122
|
312
|
323
|
350
|
274
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 43400 |
288 |
SK Hynix Inc. | 11484 |
147 |
Micron Technology, Inc. | 26210 |
146 |
Samsung Electronics Co., Ltd. | 147622 |
120 |
International Business Machines Corporation | 61471 |
101 |
Kioxia Corporation | 10441 |
52 |
United Microelectronics Corp. | 4249 |
45 |
Commissariat à l'énergie atomique et aux energies alternatives | 10946 |
31 |
TetraMem Inc. | 141 |
28 |
Intel Corporation | 47129 |
20 |
Winbond Electronics Corp. | 1292 |
20 |
GLOBALFOUNDRIES Singapore Pte. Ltd. | 812 |
19 |
Monolithic 3D Inc. | 308 |
16 |
STMicroelectronics (Crolles 2) SAS | 645 |
14 |
Xiamen Industrial Technology Research Institute Co., Ltd. | 37 |
14 |
Macronix International Co., Ltd. | 2552 |
13 |
Zeno Semiconductor, Inc. | 250 |
12 |
STMicroelectronics (Rousset) SAS | 952 |
10 |
Changxin Memory Technologies, Inc. | 4927 |
10 |
Huazhong University of Science and Technology | 1067 |
9 |
Other owners | 346 |