- All sections
- H - Electricity
- H10B - Electronic memory devices
- H10B 63/00 - Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
Patent holdings for IPC class H10B 63/00
Total number of patents in this class: 1618
10-year publication summary
|
0
|
0
|
1
|
18
|
122
|
321
|
348
|
357
|
374
|
8
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46308 |
331 |
| SK Hynix Inc. | 11732 |
167 |
| Micron Technology, Inc. | 26703 |
160 |
| Samsung Electronics Co., Ltd. | 149838 |
134 |
| International Business Machines Corporation | 61840 |
111 |
| Kioxia Corporation | 10479 |
53 |
| United Microelectronics Corp. | 4330 |
49 |
| TetraMem Inc. | 151 |
32 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10970 |
31 |
| Intel Corporation | 46510 |
20 |
| Winbond Electronics Corp. | 1332 |
20 |
| GLOBALFOUNDRIES Singapore Pte. Ltd. | 823 |
19 |
| Monolithic 3D Inc. | 320 |
17 |
| Xiamen Industrial Technology Research Institute Co., Ltd. | 39 |
16 |
| STMicroelectronics (Crolles 2) SAS | 645 |
14 |
| Macronix International Co., Ltd. | 2539 |
13 |
| Sandisk Technologies Inc. | 5082 |
12 |
| Zeno Semiconductor, Inc. | 236 |
12 |
| STMicroelectronics (Rousset) SAS | 957 |
10 |
| GLOBALFOUNDRIES U.S. Inc. | 6417 |
10 |
| Other owners | 387 |