An electronic device is provided and includes a first conductive structure, a second conductive structure, a third conductive structure, a first insulating layer, a second insulating layer, a conductive element, an electronic component, and a plurality of passive components. The first insulating layer is disposed between the first conductive structure and the second conductive structure, and the second insulating layer is disposed between the second conductive structure and the third conductive structure. The second conductive structure is electrically connected to the first conductive structure at a first position, and the third conductive structure is electrically connected to the second conductive structure at a second position, wherein a center point of the first position and a center point of the second position is misaligned along a normal direction of a surface of the first insulating layer.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/58 - Structural electrical arrangements for semiconductor devices not otherwise provided for
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
An electronic device includes a substrate, a silicon semiconductor disposed on the substrate, an oxide semiconductor disposed on the substrate, a sensor configured to receive a light and output a signal, and a light-shielding element including a conductive material and disposed between the sensor and the oxide semiconductor. The oxide semiconductor is electrically connected to the silicon semiconductor. The silicon semiconductor and the oxide semiconductor are active corresponding to the signal.
H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
A display device having a first flat region, a second flat region, and a foldable region located between the first flat region and the second flat region is provided. The display device includes a display layer, a supporting layer, and a cover layer. The supporting layer is disposed under the display layer and includes a first part and a second part separated from the first part by a gap. The cover layer is disposed on the display layer, wherein in a cross section view, a portion of the display layer and the first part of the supporting layer are overlapped in the first flat region, and another portion of the display layer and the second part of the supporting layer are overlapped in the second flat region.
H10K 50/86 - Arrangements for improving contrast, e.g. preventing reflection of ambient light
G02B 1/14 - Protective coatings, e.g. hard coatings
G02F 1/133 - Constructional arrangementsOperation of liquid crystal cellsCircuit arrangements
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H04M 1/02 - Constructional features of telephone sets
H10K 50/115 - OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
An electronic device includes a panel, a first support structure, and a second support structure. The panel has a first portion and a second portion. The first portion is rollable. The first support structure supports the panel and has a first region and a second region. The first region corresponds to the first portion and the second region corresponds to the second portion. The second support structure supports the second portion of the panel. The first support structure is disposed between the panel and the second support structure. The first support structure includes a plurality of openings in the first region, and an entity element in the first region and the second region. An area of the entity element is greater than an area of the second support structure.
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
A light emitting device includes a blue sub-pixel including a plurality of first light emitting units, a green sub-pixel including a plurality of second light emitting units and a first light converting element overlapped with the plurality of second light emitting units, and a red sub-pixel including a plurality of third light emitting units and a second light converting element overlapped with the plurality of third light emitting units. The plurality of first light emitting units are irregularly spaced in an area of the blue sub-pixel, the plurality of second light emitting units are irregularly spaced in an area of the green sub-pixel, and the plurality of third light emitting units are irregularly spaced in an area of the red sub-pixel.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 33/20 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
An electronic device includes a board, a chip, a first conductive element and a second conductive element. The board has a first surface and a second surface opposite to the first surface. The board has a first through hole penetrating from the first surface to the second surface. The first conductive element is disposed between the board and the chip. The second conductive element has a first portion and a second portion connected to the first portion. The first conductive element is disposed between the first portion of the second conductive element and the board and overlaps with the first portion of the second conductive element. In a cross-sectional view of the electronic device, the second portion of the second conductive element directly contacts a side surface of the first conductive element and extends into the first through of the board.
The disclosure provides an electronic device including a substrate, two adjacent first lines, an electrode, and a light shielding structure. The two adjacent first lines disposed on the substrate and extending along a first direction. The electrode disposed on the substrate. The light shielding structure disposed on the substrate and defined an opening. In a top view of the electronic device, at least a portion of the electrode is overlapped with the opening, the opening includes a first side, a second side, and a third side, the second side connects the first side and the third side, the first side and the third side are extending along a second direction perpendicular to the first direction, the second side has at least one straight line segment, and an acute angle is between an extension direction of the at least one straight line segment and the first direction.
A light emitting device is provided and includes a first substrate, a light blocking element disposed on the first substrate, and a plurality of light emitting diodes. The light blocking element has a first opening, a second opening, and a third opening, wherein the first opening is adjacent to the second opening, the third opening is adjacent to the first opening, and the first opening and the second opening have different areas. One of the light emitting diodes is overlapped with the third opening. The first opening and the second opening are not overlapped with the plurality of light emitting diodes in a normal direction of a surface of the first substrate.
H10H 29/855 - Optical field-shaping means, e.g. lenses
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
An electronic device is provided and includes a substrate, a first bump, a second bump, and an electronic element. The substrate includes a first through hole and a second through hole disposed adjacent to the first through hole along a direction. The first bump and the second bump are overlapped with the substrate, wherein the first bump is adjacent to the second bump along the direction. The electronic element is overlapped with the substrate and electrically connected to the first bump, wherein the substrate is disposed between the first bump and the electronic element. A distance between the first through hole and the second through hole of the substrate along the direction is different from a distance between the first bump and the second bump along the direction.
G09F 9/302 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
An electronic device includes a display panel and a viewing angle control unit. The viewing angle control unit includes a first substrate; a second substrate; a first protrusion disposed between the first substrate and the second substrate; and a first shielding unit disposed between the first substrate and the second substrate and overlapped with the first protrusion, wherein the first shielding unit and the first protrusion respectively form a first projection and a second projection on the first substrate, the first and second projections respectively have a first maximum length (A) and a second maximum length (B) in a first direction satisfying the following formula (I), and the first and second projections respectively have a first maximum width (B) and a second maximum width (b) in a second direction satisfying the following formula (II):
An electronic device includes a display panel and a viewing angle control unit. The viewing angle control unit includes a first substrate; a second substrate; a first protrusion disposed between the first substrate and the second substrate; and a first shielding unit disposed between the first substrate and the second substrate and overlapped with the first protrusion, wherein the first shielding unit and the first protrusion respectively form a first projection and a second projection on the first substrate, the first and second projections respectively have a first maximum length (A) and a second maximum length (B) in a first direction satisfying the following formula (I), and the first and second projections respectively have a first maximum width (B) and a second maximum width (b) in a second direction satisfying the following formula (II):
2
≧
A
/
a
≧
1
(
I
)
2
≧
B
/
b
≧
1.
(
II
)
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
A light emitting device includes a first data line, a first light emitting unit, and a first driving circuit. The first driving circuit is coupled between the first light emitting unit and the first data line. The first driving circuit has a first switch coupled to the first data line. The first switch is controlled to have a first turn-on action and a second turn-on action continuously. During a first time interval between the first turn-on action and the second turn-on action, the first light emitting unit is emitted in at least two first emission periods.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
A display device including a display module and an optical structure layer is provided. The display module is used for displaying an image. The optical structure layer is disposed on the display module, and comprises an anti-glare layer and an anti-reflection layer, wherein the anti-reflection layer is disposed on the anti-glare layer. A glossiness of the optical structure layer is between 4 GU and 35 GU, and a reflectivity of specular component included (SCI) of the optical structure layer is between 3% and 6%.
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
13.
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
An electronic device includes: a first substrate, wherein the first substrate is flexible; a second substrate disposed corresponding to the first substrate, wherein the second substrate is flexible; and a first conductive layer disposed on the first substrate. The first conductive layer includes: a first conductive pattern for receiving a first electrode signal and including a first bonding part; and a second conductive pattern for receiving a second electrode signal and including a second bonding part. The electronic device further includes: a second conductive layer disposed on the second substrate and electrically connected to the second conductive pattern; and a first metal layer disposed between the first substrate and at least one of the first bonding part and the second bonding part and is electrically connected to the at least one of the first bonding part and the second bonding part.
The present disclosure provides an electronic device including a flexible substrate, an electronic unit, and a cover. The flexible substrate has a first portion and a second portion. The electronic unit is disposed on the flexible substrate. The cover is disposed on the electronic unit and includes a first layer. The first layer is retreated from an edge of the first portion by a first distance and retreated from an edge of the second portion by a second distance, and the second distance is different from the first distance.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
A display device includes a substrate, a circuit layer, a display unit, and a reflectance control unit. The circuit layer is disposed on the substrate. The display unit is disposed on the substrate and electrically connected to the circuit layer. The reflectance control unit is disposed on the substrate and electrically connected to the circuit layer. The display unit and the reflectance control unit are disposed on the same side of the substrate.
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
G02F 1/167 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
G02F 1/1685 - Operation of cellsCircuit arrangements affecting the entire cell
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
An electronic device having a central area and a peripheral area surrounding the central area is provided. The electronic device includes a substrate, a through hole, a buffer layer, a first circuit structure, an electronic component and a first pad. The substrate has a first surface and a second surface opposite to the first surface. The through hole penetrates through the substrate and has a first through hole and a second through hole. The buffer layer covers the first surface, the second surface, an inner wall of the first through hole and an inner wall of the second through hole. The first circuit structure is disposed on the first surface. The first through hole corresponds to the central area, the second through hole corresponds to the peripheral area, and a width of the second through hole is greater than a width of the first through hole.
A rollable electronic device with a rollable axis includes a base layer, an insulating layer, and one or more electronic units. The insulating layer is disposed on the base layer and includes a plurality of first trenches. The first trenches have a first longitudinal direction parallel to the rollable axis. The one or more electronic units are disposed on the insulating layer. In a top view, at least one of the electronic units is disposed between two adjacent first trenches of the first trenches, and the two adjacent first trenches are overlapped with each other along a direction perpendicular to the first longitudinal direction.
An electronic device is provided. The electronic device includes a substrate, a buffer layer, an oxide semiconductor layer, a first insulating layer, and a gate electrode. The buffer layer is disposed on the substrate. The oxide semiconductor layer is disposed on the buffer layer and has a first part and a second part adjacent to the first part. The first insulating layer is disposed on the oxide semiconductor layer. The gate electrode is disposed on the first insulating layer and overlapped with the first part of the oxide semiconductor layer. Moreover, an intensity of SiN— at an interface between the first part and the first insulating layer is greater than an intensity of SiN— at an interface between the first part and the buffer layer in a spectrum measured by TOF-SIMS. A method of manufacturing an electronic device is also provided.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
An electronic device is provided. The electronic device includes a substrate, a first metal layer, and a second metal layer. The first metal layer is disposed on the substrate. The first metal layer includes a first edge and a second edge. The second metal layer is disposed on the first metal layer. The first metal layer is located between the substrate and the second metal layer. The first edge does not overlap the second metal layer. The second edge overlaps the second metal layer. A side angle of the first edge is different from a side angle of the second edge. The side angle of the second edge is greater than or equal to 30 degrees and less than or equal to 45 degrees. A method of manufacturing an electronic device is also provided.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
An electronic device including a substrate, a circuit layer, a light filtering layer, an organic insulating layer and a transparent conductive layer is provided by the present disclosure. The circuit layer is disposed on the substrate. The light filtering layer is disposed on the circuit layer and has a first via. The organic insulating layer is disposed on the light filtering layer and has a second via, wherein the second via is corresponding to the first via. The transparent conductive layer is electrically connected to the circuit layer through the first via and the second via. The first via has a first sidewall, the second via has a second sidewall, the first sidewall and the second sidewall are not continuous, and a width of the first via is less than a width of the second via.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
A method for manufacturing an electronic device includes the following steps: providing a carrier and a circuit substrate, wherein the carrier includes a plurality of spacers, the circuit substrate includes a plurality of electronic units, and the electronic units are detected and determined to be normal or defective; providing cover units on the carrier; disposing the circuit substrate on the cover units so that the spacers support the circuit substrate, wherein there is a gap between the circuit substrate and the cover units, and the cover units correspond to the electronic units determined to be normal; vacuuming the gap between the circuit substrate and the cover units; moving the spacers to make the cover units and the circuit substrate contact each other; and pressing the cover units and the circuit substrate to fix the cover units and the circuit substrate to each other.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
An electronic device includes a dimming structure, a first anti-reflection film and a second anti-reflection film. The dimming structure includes a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The dimming structure includes a first conductive layer disposed between the first substrate and the liquid crystal layer, and a second conductive layer disposed between the second substrate and the liquid crystal layer. The dimming structure is disposed between the first anti-reflection film and the second anti-reflection film, and each of the first anti-reflection film and the second anti-reflection film has a reflectivity of smaller than 2%.
G02F 1/1334 - Constructional arrangements based on polymer-dispersed liquid crystals, e.g. microencapsulated liquid crystals
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
An electronic device is provided. The electronic device includes a panel, an optical element and a film. The optical element is disposed on the panel. The optical element includes a first surface away from the panel. In a top view, the first surface has a polygonal microstructure. The film is disposed between the optical element and the panel. The film includes a second surface adjacent to the optical element. The second surface has a dot structure.
G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
24.
Electronic Device and Manufacturing Method Thereof
An electronic device includes a substrate having opposite first and second surfaces and a through hole having an inner wall connected to the first and second surfaces, a buffer layer covering the first and second surfaces and the inner wall, a conductor disposed in the through hole, a first circuit structure disposed on the first surface, an electronic element disposed on the first circuit structure, and first connectors disposed on the second surface and electrically connected to the electronic element through the conductor and the first circuit structure. The through hole has a width W and a depth D, and W/D is greater than or equal to 0.01 and less than or equal to 0.5. A thickness T of the buffer layer is greater than or equal to 0.01 μm and less than or equal to 10 μm. A manufacturing method of an electronic device is also provided.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
25.
MANUFACTURING METHOD OF ELECTRONIC DEVICE HAVING THROUGH-HOLE SUBSTRATE AND ELECTRONIC DEVICE
A manufacturing method of an electronic device having a through-hole substrate includes: irradiating a partial region on two opposite surfaces of a substrate with a laser; and performing a through-hole formation step on the partial region of the substrate. The through-hole formation step includes: performing an etching step to form opposite etching profiles in the partial region on the two opposite surfaces of the substrate; performing a buffer layer coating step to form a buffer layer on the two opposite surfaces of the substrate and the opposite etching profiles; and repeating the etching step and the buffer layer coating step until the opposite etching profiles form a through hole. An electronic device is also provided.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
26.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
An electronic device includes a display panel and a viewing angle switchable panel disposed on the display panel. The display panel includes: a first substrate; a second substrate disposed opposite to the first substrate; and a display medium layer disposed between the first substrate and the second substrate. The viewing angle switchable panel is provided with: a third substrate; a fourth substrate disposed opposite to the third substrate; and a switching medium layer disposed between the third substrate and the fourth substrate. At least one of the third substrate and the fourth substrate has a thickness of 5 μm to 50 μm.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
An electronic device, having a first region and a second region adjacent to the first region, is provided. The electronic device includes a light sensor, a first light-emitting element, and a second light-emitting element. The light sensor is disposed in the first region and is configured to receive a light signal. The first light-emitting element is disposed in the first region. The second light-emitting element is disposed in the second region. The first light-emitting element is driven by a first driving signal. The first driving signal has a first duty cycle. The second light-emitting element is driven by a second driving signal. The second driving signal has a second duty cycle. The first duty cycle has a first duty ratio. The second duty cycle has a second duty ratio. The first duty ratio is less than the second duty ratio. The electronic device provides a better light sensing function.
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
An electronic device includes a substrate, an electrical component, a signal line, a fan-out line and a switch. The substrate includes an active area and a peripheral area. The electrical component is disposed on the substrate and in the active area. The signal line is disposed on the substrate and in the active area, and the signal line is coupled to the electrical component. The fan-out line is disposed on the substrate and in the peripheral area. The switch is disposed area and the peripheral area, wherein the switch is coupled between the signal line and the fan-out line. The switch is controlled to transmit a signal from the fan-out line to the signal line during the switch is turned on, and the electrical component is operated in different refreshing frequencies according to the signal.
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
An electronic device including a flexible substrate, a plurality of electronic components, and a first driving unit is provided. The flexible substrate includes a surface having a first region and a second region. The first region has a Gaussian curvature of 0 and the second region has a non-zero Gaussian curvature. The plurality of electronic components are disposed on the flexible substrate. The first driving unit is disposed on the first region of the flexible substrate. One of the plurality of electronic components located on the second region of the flexible substrate is driven by the first driving unit.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes a detection step. The detection step is used to detect the pressure distribution of a manufacturing element. The detection step includes: providing a detection element; pressing the manufacturing element on the detection element to generate a plurality of indentation patterns; converting the plurality of indentation patterns into a plurality of image data; using the plurality of image data to calculate an image feature value; and comparing a relationship between the image feature value and a threshold, and generating a comparison result.
A detection system is provided. The detection system includes an optical detection module and a control module. The optical detection module includes a first light source, a second light source, and an image capturing component. The first light source provides a first light beam to illuminate an object to be measured. The second light source provides a second light beam to illuminate the object to be measured. The image capturing component is used to capture the object to be measured. The wavelength of the first light beam is different from the wavelength of the second light beam. The wavelength of either the first light beam or the second light beam is between 300 nanometers and 3000 nanometers. The control module receives and analyzes an image of the object to be measured obtained from the image capturing component to determine whether the object to be measured has a defect.
A display device has a transmissive area and a reflective area. The transmissive area corresponds to a first sub-pixel, and the reflective area corresponds to a second sub-pixel. The display device includes a backlight module, a liquid crystal module, and an anti-reflective layer. The liquid crystal module is disposed on the backlight module and includes a first substrate, a component layer, and a reflective layer. The component layer is disposed on the first substrate and includes a first transistor and a second transistor. The first transistor is configured to drive the first sub-pixel, and the second transistor is configured to drive the second sub-pixel. The reflective layer is disposed on the component layer and corresponds to the reflective area. The anti-reflective layer is disposed on the liquid crystal module.
G09G 3/36 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source using liquid crystals
The disclosure provides a light emitting device including a substrate and a plurality of sub-pixels disposed on the substrate. The plurality of sub-pixels include a first sub-pixel of a first color, a second sub-pixel of a second color different from the first color, and a third sub-pixel of the second color, wherein the first sub-pixel is disposed adjacent to the second sub-pixel, and the first sub-pixel is disposed adjacent to the third sub-pixel, and wherein a width of the second sub-pixel along a first direction is different from a width of the third sub-pixel along the first direction.
An electronic device including an electronic module, an inflator and an airbag is disclosed. The airbag is configured to be inflated by a gas produced by the inflator. The electronic module is disposed on the airbag and includes a first surface, a corner connecting with the first surface and a second surface opposite to the first surface. When the airbag is not inflated by the gas, at least a portion of the second surface is disposed between the first surface and the air bag, and the electronic module is at least partially overlapped with the airbag and not overlapped with the inflator in a top-view direction of the electronic module. When the airbag is inflated by the gas, the airbag contacts the corner of the electronic module, and the airbag at least partially contacts the first surface of the electronic module in the top-view direction of the electronic module.
B60R 21/205 - Arrangements for storing inflatable members in their non-use or deflated conditionArrangement or mounting of air bag modules or components in dashboards
B60K 35/50 - Instruments characterised by their means of attachment to or integration in the vehicle
B60K 35/60 - Instruments characterised by their location or relative disposition in or on vehicles
B60R 21/203 - Arrangements for storing inflatable members in their non-use or deflated conditionArrangement or mounting of air bag modules or components in steering wheels or steering columns
An electronic device includes a display panel, wherein the display panel includes a plurality of light emitting units, a plurality of signal lines electrically connected with the plurality of light emitting units, and a plurality of transparent areas, wherein one of the plurality of transparent areas is disposed between adjacent two of the plurality of signal lines. One of the plurality of transparent areas is adjacent to one of the plurality of light emitting units. A length of one of the plurality of light emitting units is different from a length of one of the plurality of transparent areas in an extending direction of one of the plurality of signal lines. An area of one of the plurality of light emitting units is less than an area of one of the plurality of transparent areas.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
An electronic device includes a first substrate, a driving element, a first protrusion, a second protrusion and a plurality of third protrusions. The first substrate includes an edge, a first region, and a second region. The second region is disposed between the edge and the first region. The driving element is disposed in the first region. The first protrusion is disposed on the first substrate in the first region, and has a first thickness. The second protrusion is disposed on the first substrate in the second region, and has a second thickness. The third protrusions are disposed on the first substrate. The first protrusion is disposed between two of the third protrusions. At least one of the third protrusions has a third thickness. The first thickness is different from the second thickness, and the third thickness is less than the first thickness.
An electronic device is provided. The electronic device includes a slew rate control circuit. The slew rate control circuit includes a first transistor, a second transistor, an input terminal, and an output terminal. The slew rate control circuit is configured to receive a scan signal switching between a first high voltage level and a first low voltage level, and output an adjusted scan signal switching between a second high voltage level and a second low voltage level. The first transistor and the second transistor are the same type of transistors, and each forms a diode or a source follower amplifier.
G09G 3/36 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source using liquid crystals
A method for manufacturing an electronic device is provided. The method includes providing a first substrate. The method further includes forming a bank layer on the first substrate. The bank layer includes a bank wall and a first opening, and the first opening adjacent to the bank wall. The method further includes forming a light conversion layer in the first opening. The method further includes forming a spacer on the bank wall. The method further includes providing a second substrate. The method further includes transferring a plurality of electronic units to the second substrate. The method further includes overlapping the first substrate and second substrate, so that the spacer is located between the first substrate and the second substrate.
An electronic device includes a substrate including a first surface and a second surface opposite to the first surface; a first data line and a second data line disposed on the first surface of the substrate and extending along a first direction; a first electronic unit disposed on the first surface of the substrate; a first control unit disposed on the first surface of the substrate; a first scan line crossing the first data line and the second data line, wherein the first control unit is electrically connected between the first electronic unit and the first scan line; a first switch element disposed on the first surface of the substrate, and comprising a first gate; a first conductive pad disposed on the second surface of the substrate; and a first signal line electrically connected between the first gate of the first switch element and the first conductive pad.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
An electronic device including a first base, a first conductive layer, an insulating layer, a first electronic element, a second base, and a second electronic element is provided. The first conductive layer is disposed on the first base. The insulating layer is disposed on the first conductive layer and has a first hole, wherein the first hole exposes at least a portion of the first conductive layer. The first electronic element is disposed on the first base. The second base is disposed between the insulating layer and the first electronic element, and has a second hole. The second electronic element is electrically connected to the first conductive layer. The first electronic element is electrically connected to the first conductive layer via the second hole and the first hole, and in a cross-sectional view of the electronic device, the second hole is different from the first hole in width.
An electronic device is provided. The electronic device includes a substrate, a thin-film transistor, a first organic layer, a conductive layer, a second organic layer and a photoresist element. The thin-film transistor is disposed on the substrate. The first organic layer is disposed on the thin-film transistor and has a through-hole. The conductive layer is disposed on the first organic layer and electrically connected to the thin-film transistor through the through-hole. The second organic layer includes a first portion and a second portion. The first portion of the second organic layer is disposed in the through-hole, and the second portion of the second organic layer covers at least a portion of a flat portion of an upper surface of the first organic layer. The photoresist element is disposed on the second organic layer.
G02F 1/1368 - Active matrix addressed cells in which the switching element is a three-electrode device
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
An electronic device is provided, which includes a first substrate, a second substrate, a data line, a scan line, a first spacer, and a second spacer. The data line extends along a first direction. The scan line has an extension part extending along a second direction and a gate electrode extending along the first direction. The gate electrode has an arc-shaped connection side connecting with the extension part. The first spacer is on the first substrate. The second spacer is between the first spacer and the second substrate. A length of the second spacer is greater than a width of the gate electrode along the second direction. The first spacer, the second spacer, the data line, and the gate electrode overlap with each other. The first spacer crosses the gate electrode of the scan line and the extension part of the scan line along the first direction.
An electronic device is provided. The electronic device includes a substrate, a signal line, a first electronic unit, a conductive structure and a light blocking layer. The signal line is disposed on the substrate. The first electronic unit is disposed on the substrate and includes a first electrode. The conductive structure is disposed on the substrate and includes a first conductive pattern, an insulating layer disposed on the first conductive pattern, and a second conductive pattern disposed on the insulating layer. The second conductive pattern is electrically connected to the first conductive pattern through a first opening of the insulating layer. The first electrode is electrically connected to the signal line through the conductive structure. The light blocking layer is overlapped with the conductive structure.
An electronic device is provided, including a chip unit, a heat dissipation film, an encapsulation layer, a through hole, and a circuit structure. The chip unit has a first side and a second side opposite to the first side. The heat dissipation film is disposed on the first side. The encapsulation layer surrounds the chip unit and the heat dissipation film. The through hole penetrates the encapsulation layer, and has a first position and a second position. The circuit structure is disposed on the second side. The through hole is electrically connected to the chip unit through the circuit structure. The first position is connected to the circuit structure, and the second position is farther away from the circuit structure than the first position. The first position has a first width, the second position has a second width, and the first width is greater than the second width.
H01L 23/367 - Cooling facilitated by shape of device
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
An electronic device includes a substrate, a first mesh structure, a second mesh structure and a sub-pixel. The first mesh structure is disposed on the substrate and has a plurality of first openings. The second mesh structure is disposed adjacent to the first mesh structure and has a plurality of second openings. The sub-pixel overlaps one of the plurality of first openings in a top-view direction. In the top-view direction, the first mesh structure and the second mesh structure are separated by a minimum distance along a first direction, and the minimum distance is less than a maximum width of the sub-pixel along the first direction.
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
A method of manufacturing an electronic device including the following steps is provided herein. Providing a plurality of first electronic components on a first structure. Providing a plurality of receiving sites on a second structure. Performing a first transferring, including transferring at least portion of the plurality of first electronic components onto at least portion of the plurality of receiving sites on the second structure. Figuring out an empty receiving site from the plurality of receiving sites, wherein the plurality of first electronic components is absent at the empty receiving site. Performing a second transferring, including transferring a second electronic component onto the empty receiving site on the second structure. Providing a target substrate, and transferring the at least portion of the plurality of first electronic components and the second electronic component on the second structure onto the target substrate.
An electronic device including a die and a connection structure electrically connected to the die is disclosed. The connection structure includes a first insulating layer including an opening, a second insulating layer, a first metal element disposed between the first insulating layer and the second insulating layer, a second metal element disposed in the opening and electrically connected to the first metal element, and a conductive element. The second metal element is electrically connected between the conductive element and the first metal element. A first surface and a second surface of the first insulating layer are contacted with the first metal element and the conductive element respectively. The first insulating layer includes first filling elements, the second insulating layer includes second filling elements, and in a cross-sectional view, a second maximum size of the second filling elements is greater than a first maximum size of the first filling elements.
Disclosed are an electronic device and a manufacturing method thereof. The electronic device includes a circuit structure and at least one contacting part. The at least one contacting part is disposed on the circuit structure, and includes an insulating part and a conductive layer. The conductive layer surrounds the insulating part, and the conductive layer is electrically connected to the circuit structure. The electronic device disclosed herein may have a buffering effect or reduce damage to an object to be detected.
A sensing device is provided, which comprises: a substrate; a circuit layer disposed on the substrate, the circuit layer comprising a switch element; a reflector disposed on the circuit layer, the reflector comprising a first reflection part and a second reflection part separated from each other, wherein the first reflection part is electrically connected to the switch element, and the second reflection part receives a voltage; and a sensing element disposed on the reflector, the sensing element separated from the reflector by a gap, wherein the sensing element comprises a first absorbing part, a second absorbing part and a sensing part disposed on the first absorbing part and the second absorbing part; wherein in a normal direction of the sensing device, the first absorbing part and the second reflection part are not overlapped, and the second absorbing part and the first reflection part are not overlapped.
G01J 5/0801 - Means for wavelength selection or discrimination
G01J 5/20 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
G01J 5/58 - Radiation pyrometry, e.g. infrared or optical thermometry using absorptionRadiation pyrometry, e.g. infrared or optical thermometry using extinction effect
An electronic device includes a substrate, a semiconductor disposed on the substrate, a first signal line, a first electrode disposed on the semiconductor, a first insulating layer disposed on the first electrode, a second electrode disposed on the first insulating layer, a second insulating layer disposed on the second electrode, and a third electrode disposed on the second insulating layer. The first signal line is overlapped with the semiconductor. The first electrode is electrically connected to the semiconductor. The second electrode is electrically connected to the first electrode through a first contact hole of the first insulating layer. The third electrode is electrically connected to the second electrode through a second contact hole of the second insulating layer. The first contact hole and the second contact hole are respectively disposed on two opposite sides of the first signal line in a top view of the electronic device.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
An electronic device is provided. The electronic device includes an active area, a side edge, and a peripheral area disposed between the active area and the side edge. In the peripheral area, the electronic device includes a substrate, an insulating structure and an organic layer. The insulating structure is disposed on the substrate and includes a first portion, a second portion, a third portion, and a fourth portion sequentially disposed along a first direction. In a cross-sectional view, a thickness of the first portion and a thickness of the third portion are greater than a thickness of the second portion and a thickness of the fourth portion, and a width of the second portion and a width of the fourth portion are different. In a top view, an extension direction of the second portion is parallel to the side edge and different from the first direction.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
An electronic device is provided and comprises a substrate, a first mesh unit, a first sub-pixel, and a second sub-pixel. The first mesh unit is disposed on the substrate, wherein the first mesh unit comprises a plurality of first mesh openings. The first sub-pixel and the second sub-pixel are disposed on the substrate, wherein the first sub-pixel and the second sub-pixel are overlapped with one of the plurality of first mesh openings in a top view direction of the electronic device. The first sub-pixel generates a first color light, the second sub-pixel generates a second color light, and the second color light is different from the first color light in color.
A method of manufacturing an electronic device includes providing a substrate with a predetermined first-hole region, a first surface, and a second surface. The second surface is opposite the first surface. The method includes laser processing the predetermined first-hole region from the first surface to form a first laser track and laser processing the predetermined first-hole region from the first surface to form a second laser track. The first laser track does not overlap the second laser track. The method further includes etching the predetermined first-hole region to form a first-hole.
An electronic device including a substrate, a light-shielding layer, a first insulating layer, a semiconductor layer, a second insulating layer and a drain is disclosed. The light-shielding layer is disposed on the substrate. The first insulating layer is disposed on the light-shielding layer. The semiconductor layer is disposed on the first insulating layer. The second insulating layer is disposed on the semiconductor layer and has a hole, and the hole exposes a portion of the first insulating layer. The drain is connected to the semiconductor layer through the hole. A first minimum distance exists between the above portion of the first insulating layer and the light-shielding layer, a second minimum distance exists between the semiconductor layer and the light-shielding layer, and a ratio of the first minimum distance to the second minimum distance is greater than or equal to 0.1 and less than or equal to 1.0.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
An electronic device including a panel and an actuator is disclosed. The panel includes a first substrate, a second substrate and a plurality of light-emitting elements. The second substrate is disposed on the first substrate, and the second substrate includes a plurality of main portions and a plurality of openings. The plurality of light-emitting elements are disposed on the plurality of main portions of the second substrate. The first substrate is disposed between the actuator and the second substrate. In a deformation mode, the panel is deformed by the actuator.
An electronic device includes a substrate, a first transistor, a second transistor, an electronic unit and a conductor. The first transistor is disposed on the substrate and comprises an oxide semiconductor layer. The second transistor is disposed on the substrate and comprises a silicon semiconductor layer. The electronic unit is disposed on the substrate and electrically connected to the second transistor. The conductor is electrically connected to the oxide semiconductor layer and the silicon semiconductor layer.
G09G 3/3266 - Details of drivers for scan electrodes
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G09G 3/3225 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
G09G 3/36 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source using liquid crystals
G11C 19/28 - Digital stores in which the information is moved stepwise, e.g. shift registers using semiconductor elements
H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
57.
ELECTRONIC DEVICE AND AUGMENTED REALITY ELECTRONIC DEVICE
An electronic device includes a light adjusting component. The light adjusting component includes a panel, a first quarter wave plate and a second quarter wave plate. The panel includes a first substrate, a second substrate and a medium layer disposed between the first substrate and the second substrate. The first quarter wave plate is disposed on a first side of the panel, wherein the first quarter wave plate has a first retardation amount. The second quarter wave plate is disposed on a second side of the panel opposite to the first side, wherein the second quarter wave plate has a second retardation amount. The first retardation amount is different from the second retardation amount.
A display device including a pixel circuit is provided. The pixel circuit includes a first sub-pixel circuit, a second sub-pixel circuit, a third sub-pixel circuit, a first data line, a second data line, and a scan line. A first light-emitting unit of the first sub-pixel circuit electrically connected to the first driving transistor and the second driving transistor of the first sub-pixel circuit. The second sub-pixel circuit includes a third driving transistor, a switch circuit, and a second light-emitting unit electrically connected to the third driving transistor. The first data line provides a first data voltage to a gate terminal of second driving transistor. The second data line provides a second data voltage to a second gate terminal of the third driving transistor of the second sub-pixel circuit. A control terminal of the switch circuit of the second sub-pixel circuit is directly connected to the scan line.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G09G 3/30 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels
G09G 3/3208 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
G09G 3/3225 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
A display device, characterized in that the display device includes a first panel, having a first side and a first light shielding layer at a periphery of the first panel, wherein the first light shielding layer has a first edge departing away from the first side; and a second panel, disposed on the first panel, and having a second side adjacent to the first side; wherein the second panel includes a second light shielding layer at a periphery of the second panel; and the second light shielding layer has a second edge departing away from the second side. Wherein a first width is measured from the first side to the first edge along a direction, a second width is measured from the second side to the second edge along the direction, the second width is greater than the first width, and the direction is vertical to the first side.
G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
G02F 1/133 - Constructional arrangementsOperation of liquid crystal cellsCircuit arrangements
An electronic device includes a substrate, a first organic portion, a first opening, a second organic portion, a second opening, a third organic portion and a first element. In a cross-section view, the first organic portion, the first opening, the second organic portion, the second opening and the third organic portion are disposed on the substrate and arranged in a first direction, the first opening is located between the first organic portion and the second organic portion, the second opening is located between the second organic portion and the third organic portion, the second organic portion is located between the first organic portion and the third organic portion, and a width of the first organic portion and a width of the third organic portion are less than a width of the second organic portion in the first direction. The first element is overlapped with the first opening.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
61.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
A method of manufacturing an electronic device is provided. The method includes providing a substrate, disposing a composite conductive layer on the substrate, and patterning the composite conductive layer into a composite conductive pattern in two wet etching steps. Moreover, the two wet etching steps use different etching solutions.
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes at least two sub-parts, and the at least two sub-parts respectively include a first upper surface. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole passes through the first substrate and exposes a portion of the second upper surface. Furthermore, the conductive material is partially disposed in the through hole and in contact with at least one first upper surface and the second upper surface.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
63.
DISPLAY DEVICE AND DRIVING METHOD FOR DISPLAY DEVICE
A display device and a driving method for the display device are provided. The display device includes a driving circuit, a backlight driving unit, and a display panel. The driving circuit receives a plurality of pieces of image data. The plurality of pieces of image data include first image data and second image data. The display panel receives a plurality of image display signals of the plurality of pieces of image data. The driving circuit compares the first image data and the second image data to generate a comparison result, and provides a backlight brightness adjustment command to the backlight driving unit according to the comparison result.
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
64.
DISPLAY DEVICES AND METHODS FOR MANUFACTURING THE SAME
A method for manufacturing a display device is provided. The method includes providing an array module having at least one first alignment mark. The method also includes providing a light-emitting module having at least one second alignment mark. The method further includes aligning the light-emitting module and the array module by the at least one first alignment mark and the at least one second alignment mark. In addition, the method includes bonding the light-emitting module onto the array module.
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
An electronic panel including a substrate, a first semiconductor element and a first color conversion element is provided by the present disclosure. The substrate has a functional region capable of allowing a light to pass through. The first semiconductor element is disposed on the functional region, wherein the first semiconductor element includes a first electrode, a first semiconductor layer disposed on the first electrode, and a second electrode disposed on the first semiconductor layer. The first color conversion element is disposed on the first semiconductor element and overlapped with the first semiconductor layer. In a top view of the electronic panel, a center of the first color conversion element is deviated from a center of the first semiconductor layer.
An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes a first upper surface. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole penetrates through the first substrate. In addition, in a top-view diagram, an area of the through hole is larger than an area of the first conductive pad. The conductive material is partially disposed in the through hole and in contact with the first upper surface and the second upper surface.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
An electronic device includes a first dimming device and a second dimming device. The first dimming device includes a first dimming module having a first liquid-crystal layer and a second dimming module having a second liquid-crystal layer. The second dimming device includes a third dimming module having a third liquid-crystal layer and a fourth dimming module having a fourth liquid-crystal layer. The liquid-crystal molecules of the first liquid-crystal layer have a first alignment angle, the liquid-crystal molecules of the third liquid-crystal layer have a third alignment angle, and the first alignment angle is different from the third alignment angle.
The present disclosure provides an electronic device including a display and a light-adjustable control panel including a plurality of light control units. The light-adjustable control panel includes a first substrate, a second substrate, and a display medium sandwiched between the first substrate and the second substrate. In a first displaying mode, the light control units form a plurality of first transparent regions and a plurality of non-transparent regions alternately arranged, and in a second displaying mode, the control units form a second transparent region. A ratio of a total area of the first transparent regions to a total area of the light control units is different from a ratio of an area of the second transparent region to the total area of the light control units.
G09G 3/3208 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/13363 - Birefringent elements, e.g. for optical compensation
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G09G 3/36 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source using liquid crystals
H01L 25/13 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group
An electronic device includes a panel. The panel includes a substrate, and a plurality of signal lines and a test circuit are disposed on the substrate. The test circuit includes a first switch device and a second switch device that are electrically connected to a same switch signal line. A first conductive component is connected between the first switch device and one of the signal lines. A second conductive component is connected between the second switch device and another one of the signal lines. The first conductive component and the second switch device are at least partially overlapped.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 23/528 - Layout of the interconnection structure
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
An electronic device includes a substrate, a circuit structure, a light blocking layer and an opening. The circuit structure is disposed on the substrate and includes at least one data wire, at least one scan wire, a plurality of primary bonding pads, and a plurality of reserved bonding pads. The plurality of primary bonding pads are configured to be bonded with electronic elements, and the plurality of reserved bonding pads are configured to be bonded with repair or backup electronic elements. The light blocking layer is disposed on the substrate and overlapping with the circuit structure. A material of the light blocking layer includes metal. The opening is surrounded and enclosed by the light blocking layer, and configured to allow ambient light to penetrate. The opening does not overlap with the plurality of primary bonding pads and the plurality of reserved bonding pads.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An electronic device is provided. The electronic device includes a first substrate; a second substrate disposed opposite to the first substrate; a liquid crystal layer disposed between the first substrate and the second substrate; a plurality of first electrodes disposed between the first substrate and the liquid crystal layer; a plurality of second electrodes disposed between the second substrate and the liquid crystal layer; a first signal line disposed between the first substrate and the liquid crystal layer, and electrically connected to one of the plurality of first electrodes; and a second signal line disposed between the second substrate and the liquid crystal layer, and electrically connected to one of the plurality of second electrodes. The first signal line and the second signal line include a blackened metal.
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/1345 - Conductors connecting electrodes to cell terminals
G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
A manufacturing method of an electronic device includes: providing a substrate; disposing a conductive layer on the substrate; performing a patterning step to pattern the conductive layer, such that a grid structure having a plurality of grid units is formed in the conductive layer, and the conductive layer which is patterned includes a first portion and a second portion at least; and performing an electroplating step to electroplate at least one of the first portion and the second portion, such that a thickness of the first portion is different from a thickness of the second portion after performing the electroplating step.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
where A, B and C represents the first, second and third brightness values, respectively, the third brightness value is the maximum brightness value of the backlight module, and the first, second and third angles are different from each other.
An electronic device is provided, including a substrate, a conductive element, and an insulating layer. The conductive element is disposed on the substrate and has a side wall. The conductive element includes a first layer and a second layer. The second layer is disposed on the first layer. The insulating layer is disposed on the conductive element. A thickness of the second layer is greater than a thickness of the first layer. At least a portion of the side wall is uneven, and a portion of the insulating layer is disposed corresponding to the side wall.
The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 29/93 - Variable-capacitance diodes, e.g. varactors
A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a plurality of semiconductor elements; performing a packaging process on the plurality of semiconductor elements to form a plurality of packaged semiconductor elements, wherein the packaging process includes disposing a plurality of filling material layers respectively on a sidewall of each of the plurality of semiconductor elements; providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes at least one first recess; and disposing the plurality of packaged semiconductor elements in the at least one first recess of each of the plurality of working areas through fluid transfer.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
An electronic device is provided. The electronic device includes a first substrate, a second substrate, a first wire and an adhesive material. The first wire is disposed on the first substrate and has a first portion and a second portion. Each the first portion and the second portion has a plurality of apertures. The adhesive material is disposed between the first wire and the second substrate and overlapped with the first wire in a top view of the electronic device. Moreover, at least one of the first portion and the second portion has at least two apertures with different areas. The first portion has a first aperture ratio AR1. The second portion has a second aperture ratio AR2. A difference between the first aperture ratio AR1 and the second aperture ratio AR2 is greater than 0% and less than 10%.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
A viewing angle controlling device includes a first substrate, a second substrate disposed opposite to the first substrate, a viewing angle controlling medium disposed between the first substrate and the second substrate, a first alignment layer disposed between the first substrate and the viewing angle controlling medium and having a first anchoring strength, a second alignment layer disposed between the second substrate and the viewing angle controlling medium and having a second anchoring strength, a first polarizer, and a compensation layer disposed between the first polarizer and the viewing angle controlling medium. The first substrate is disposed between the first polarizer and the first alignment layer. The first anchoring strength is less than the second anchoring strength.
G02F 1/29 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the position or the direction of light beams, i.e. deflection
79.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method manufactures an electronic device, and includes the steps of: providing a first temporary panel including a first carrier board, a first substrate, a second substrate and a second carrier board arranged in sequence; providing a second temporary panel including a third carrier board, a third substrate, a fourth substrate and a fourth carrier board arranged in sequence; and removing the second carrier board and the third carrier board, and fixing the second substrate and the third substrate with an attaching member.
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
The disclosure provides a display device including a first panel and a second panel. The first panel is configured for regionalizing brightness adjustment and includes a first pixel unit comprising a sub-pixel electrode and a common electrode overlapped with the sub-pixel electrode; and a common line, wherein the common electrode and the common line are electrically connected to each other through a contact hole. The second panel is disposed corresponding to the first panel. The second panel is disposed corresponding to the first panel and configured for displaying color information of a screen. The second panel includes a second pixel unit, wherein the first pixel unit and the second pixel unit are at least partially overlapped.
G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
An electronic device includes a foldable panel and a metal layer. The foldable panel includes a substrate having a first surface and a second surface opposite to the first surface, a circuit layer disposed on the first surface of the substrate, and a cover layer disposed on the first surface of the substrate. The circuit layer is disposed between the substrate and the cover layer. The metal layer is disposed on the second surface of the substrate. The foldable panel includes a first portion and a second portion, and in a folded mode, at least a part of the metal layer is disposed between the first portion and the second portion of the foldable panel.
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
H01L 23/60 - Protection against electrostatic charges or discharges, e.g. Faraday shields
H04M 1/02 - Constructional features of telephone sets
An electronic device includes a substrate and a transistor. The transistor is disposed on the substrate and includes an oxide semiconductor, a first conductive element and a second conductive element. The oxide semiconductor is disposed on the substrate. The first conductive element is disposed between the substrate and the oxide semiconductor. The second conductive element is disposed on the oxide semiconductor and overlapped with the first conductive element. In a top view of the transistor, the second conductive element has an arc angle.
A backlight module includes: a back plate; a first optical film disposed on the back plate; and a second optical film disposed on the first optical film. The first optical film includes a plurality of first protrusions that protrude toward the second optical film, and at least one of the plurality of first protrusions has a first height. The first height is greater than or equal to 4 μm and smaller than or equal to 10 μm.
An electronic device includes a first substrate, a second substrate, a circuit layer, a diode element, and a conductive wire. The first substrate has a first surface, a second surface opposite to the first surface, and a first side surface connected between the first surface and the second surface. The second substrate has a third surface, a fourth surface opposite to the third surface, and a second side surface connected between the third surface and the fourth surface, wherein the fourth surface is disposed away from the first surface. The circuit layer and the diode element are disposed on the first surface. The diode element and the conductive wire are electrically connected to the circuit layer. A first portion of the conductive wire is disposed on the first side surface, and a second portion of the conductive wire is disposed on the second side surface.
An electronic device comprises a substrate, a semiconductor element disposed on the substrate and comprising a top surface, a bottom surface and a side surface connected between the top surface and the bottom surface, and a shielding element comprising a first portion, a second portion and a third portion. The first portion is disposed between the bottom surface of the semiconductor layer and the substrate, the second portion surrounds the side surface of the semiconductor element, and the semiconductor element is disposed between the first portion and the third portion.
An electronic device includes: a substrate; a gate electrode disposed on the substrate; a data line disposed on the substrate and extending along an extension direction; a power line disposed on the substrate, wherein a part of the power line is overlapped with the gate electrode; and a connecting member disposed on the substrate and electrically connected to the gate electrode, wherein the connecting member includes a first part overlapped with the gate electrode and a second part not overlapped with the gate electrode, wherein in a top view, an outline of the connecting member includes a first curve section, and an outline of the gate electrode includes a second curve section.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/528 - Layout of the interconnection structure
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
H10K 59/131 - Interconnections, e.g. wiring lines or terminals
A display device includes a display panel having a first area and a second area. The display panel includes a substrate and a plurality of pixels disposed on the substrate and disposed in the first area and the second area, wherein a transmittance of the second area is greater than a transmittance of the first area. The display device further includes a supporting layer supporting the display panel, an adhesive layer connecting the supporting layer and the substrate of the display panel, and an optical sensing module disposed corresponding to the second area and having an aperture being able to accept lights through the second area. An opening is formed in the supporting layer and the adhesive layer, the opening exposes a bottom surface of the substrate, and the optical sensing module is disposed in the opening.
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
An electronic device includes a light source and an optical sensor. The light source emits a light having a maximum light intensity at a first wavelength A. The optical sensor has a maximum response value at a second wavelength B, and receives a reflected portion of the light that is reflected by an object. The integral value of the light intensity of the light from the wavelength 380 nm to the first wavelength A is I1. The integral value of the light intensity of the light from the first wavelength A to the wavelength 780 nm is I2. The first wavelength A, the second wavelength B, the integral value I1, and the integral value I2 satisfy the following equation: (B-A)*(I2-I1)>0.
A writable device is provided. The writable device includes a first substrate, a second substrate, a liquid-crystal layer, a first alignment layer and a second alignment layer. The second substrate is opposite to the first substrate. The liquid-crystal layer is disposed between the first substrate and the second substrate. The first alignment layer is disposed between the first substrate and the liquid-crystal layer. The second alignment layer is disposed between the second substrate and the liquid-crystal layer. The first alignment layer and the second alignment layer are vertically oriented. In its initial state, the liquid-crystal layer is in a transparent state. In the writing state, the liquid-crystal layer corresponding to the pressed writing area is in a scattering state. In its clear state, at least a part of the liquid-crystal layer corresponding to the pressed writing area is in the transparent state.
G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
An electronic device includes a flexible display, a sensor electrode, and a plurality of signal lines. The flexible display includes a plurality of light emitting diodes. The sensor electrode is disposed on the flexible display. The plurality of signal lines is electrically connected to the sensor electrode, wherein the plurality of signal lines includes a mesh structure, the mesh structure includes a first opening, and a second opening adjacent to the first opening, in the at least a portion of a bending region, one of the plurality of light emitting diodes is in the first opening, another one of the plurality of light emitting diodes is in the second opening, and a displaying color of the one of the plurality of light emitting diodes in the first opening is different from a displaying color of the another one of the plurality of light emitting diodes in the second opening.
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
An electronic device includes a substrate and a wiring structure disposed on the substrate. The substrate includes a first surface, a second surface, a first side surface, and a second side surface. The wiring structure includes a first wiring, a second wiring, a third wiring, a first pad, and a second pad, the first pad is electrically connected to the first wiring through the second wiring, and the second pad is electrically connected to the first wiring through the third wiring. The second wiring includes a first line segment disposed on the first surface, a second line segment disposed on the first side surface, and a third line segment disposed on the second surface. The third wiring includes a fourth line segment disposed on the first surface, a fifth line segment disposed on the second side surface, and a sixth line segment disposed on the second surface.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
92.
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
An electronic device includes a circuit structure, an electronic component electrically connected to the circuit structure, an antenna unit disposed on the circuit structure, and a shielding layer surrounding the electronic component. The circuit structure has a first surface and a second surface opposite to the first surface. The first surface has a first portion, a second portion, and a third portion, wherein the third portion connects the first portion and the second portion. In the normal direction of the electronic device, the third portion is closer to the second surface than the first portion or the second portion, thereby forming a recess. The electronic component is disposed in the recess. The antenna unit is disposed on the first surface of the circuit structure and is electrically connected to the electronic component through the circuit structure.
An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a buffer layer, an oxide semiconductor layer, and a gate electrode. The buffer layer is disposed on the substrate. The oxide semiconductor layer is disposed on the buffer layer and has a first part and a second part adjacent to the first part. The gate electrode is overlapped with the first part. A part of the buffer layer is overlapped with the second part of the oxide semiconductor layer, The part of the buffer layer has a first portion and a second portion disposed on the first portion. The concentration of boron in the first portion is greater than the concentration of boron in the second portion.
An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes a first upper surface and a first side surface. The second substrate is disposed opposite to the first substrate. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole penetrates through the first substrate. In addition, in a top-view diagram, the through hole includes an extension area. The conductive material is partially disposed in the extension area and in contact with the first upper surface and the second upper surface.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
95.
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
An electronic device including a glass substrate, a first circuit structure, and a second circuit structure. The glass substrate has a first side and a second side opposite to the first side, and includes a through via. The first circuit structure is disposed on the first side. The first circuit structure at least partially overlaps the through via. The second circuit structure is disposed on the second side. The second circuit structure at least partially overlaps the through via. The first circuit structure and the second circuit structure are electrically connected through the through via, and a thickness of the glass substrate is greater than or equal to 50 micrometers (μm) and less than or equal to 2 millimeters (mm).
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
A display device is provided. The display device includes a substrate having a surface including a display area; a plurality of light-emitting diodes disposed on the display area of the substrate, wherein the light-emitting diode includes an electrode; and a plurality of bonding pads disposed on the substrate; a conductive element disposed between one of the plurality of bonding pads and the electrode of the at least one of the plurality of light-emitting diodes; and a first matrix element disposed on the substrate, wherein in a cross-sectional view, the first matrix element is disposed between adjacent two of the plurality of light-emitting diodes, and the electrode has a sidewall profile and at least a part of the sidewall profile of the electrode is in a shape of a curve.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 33/20 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
An electronic device includes a substrate, first and second driving units, a first bus line and a first signal line. The first and the second driving units are disposed on the substrate and arranged along a first direction. The first bus line is disposed on the substrate and extends along the first direction. The first signal line has a main portion, a first branch portion, and a second branch portion. The main portion is electrically connected to the first bus line and extends along a second direction different the first direction, and the first branch portion and the second branch portion extend from the main portion in opposite direction. The first driving unit has a first transistor. The second driving unit has a second transistor. The first branch portion is electrically connected to the first transistor. The second branch portion is electrically connected to the second transistor.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
Disclosed is an image display device including a display device, an optical modulation element, and a modulation device. When the modulation device is in a first state, the display device projects a first image at a first imaging position through the optical modulation element. When the modulation device is in a second state, the display device projects a second image at a second imaging position through the optical modulation element. A minimum distance from the first imaging position to the optical modulation element is different from a minimum distance from the second imaging position to the optical modulation element.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier substrate; forming a first base layer on the carrier substrate; forming a working unit on the first base layer, performing a detection step on the working unit to identify whether a defect is present, wherein the detection step includes automated optical inspection (AOI), electrical detection, or a combination thereof; and repairing the electronic device.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
A light emitting device is provided. The light emitting device includes a backplate, a reflection layer, a circuit board, a plurality of light emitting units, and a film. The backplate includes a side portion and a bottom portion connecting to the side portion. The reflection layer is disposed on the side portion and the bottom portion. The circuit board is disposed on the bottom portion. The plurality of light emitting units are disposed on the circuit board. The film is disposed on the plurality of light emitting units and includes a plurality of protrusions. The extending direction of the lengthwise side of the circuit board is parallel to the extending direction of the plurality of protrusions. The pitch between two adjacent ones of the plurality of light emitting units is greater than the optical distance between the film and the circuit board.
