Taiwan Semiconductor Manufacturing Company, Ltd.

Taïwan, Province de Chine


 
Quantité totale PI 42 222
Quantité totale incluant filiales 42 308 (+ 255 pour les filiales)
Rang # Quantité totale PI 11
Note d'activité PI 4,9/5.0    33 567
Rang # Activité PI 7
Activité incl filiales 4,9/5.0    33 628
Symbole boursier
ISIN TW0002330008
Capitalisation 27.6T  (TWD)
Industrie Semiconductors
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

42 081 47
8 17
17 0
52
 
Dernier brevet 2025 - Semiconductor structure and meth...
Premier brevet 1985 - Amplitude enhanced sampled clipp...
Dernière marque 2025 - TSMC COMPACT
Première marque 1994 - TSMC

Filiales

3 subsidiaries with IP (252 patents, 3 trademarks)

1 subsidiaries without IP

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Semiconductors...
Invention Three-dimensional device structure including substrate-embedded integrated passive device and met...
Invention Method for forming patterned mask layer. A method for forming a patterned mask layer is provided...
Invention Semiconductor package and method of forming the same. A semiconductor package includes electric ...
Invention Method of manufacturing integrated circuit. A method for mask data synthesis and mask making inc...
Invention Semiconductor packages having conductive pillars with inclined surfaces. A semiconductor package...
Invention Method of manufacturing a semiconductor device with a work-function layer having a concentration ...
Invention Sub-word line driver placement for memory device. Disclosed herein are related to a memory syste...
Invention Semiconductor device structure with backside contact. A semiconductor device structure is provid...
Invention Benchmark device and method for evaluating a semiconductor wafer. A benchmark device and a metho...
Invention Method of manufacturing semiconductor devices. In a method of forming a groove pattern extending...
Invention Semiconductor structure and method of forming the same. A semiconductor structure includes a fir...
Invention Method of using wafer stage. A method of controlling a wafer stage includes moving the wafer sta...
Invention Annealing apparatus and method thereof. A method includes carrying a wafer by using a fork of a ...
Invention Semiconductor device with l-shape conductive feature and methods of forming the same. Semiconduc...
Invention Local gate height tuning by cmp and dummy gate design. A method includes providing a semiconduct...
Invention Inner spacer structures for gate-all-around field effect transistors. The present disclosure is ...
Invention Deep trench isolation structure and method of making the same. A semiconductor structure can inc...
Invention Reversed tone patterning method for dipole incorporation for multiple threshold voltages. A meth...
Invention Method of manufacturing a semiconductor device having corner spacers adjacent a fin sidewall. A ...
Invention Memory devices with backside boost capacitor and methods for forming the same. A device includes...
Invention Method of manufacturing a semiconductor device. A method of manufacturing a semiconductor device...
Invention Enlarging contact area and process window for a contact via. In some embodiments, the present di...
Invention Method of forming stacked unit layers and stacked two-dimensional material layers, and method of ...
Invention Semiconductor structure and method of forming the same. A semiconductor structure and a method f...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
2024 P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
Invention Gate structure profiles in semiconductor devices. A semiconductor device and a method of fabrica...
Invention Semiconductor structure with backside contacts. A semiconductor structure includes an epitaxial ...
Invention Rom device, layout, and method. A read-only memory (ROM) array includes first through fourth row...
Invention Backside metal rom device, layout, and method. A read-only memory (ROM) array includes first thr...
Invention Chip package structure with lid and method for forming the same. A chip package structure is pro...
Invention Systems and methods for performing floating point mac operations with improved cim. A memory cir...
Invention Semiconductor devices with reduced leakage current and methods of forming the same. Semiconducto...
Invention Integrated circuit device with thin-film resistor using positive and negative temperature coeffic...
Invention Systems and methods for performing mac operations with reduced computation resources. A computin...
Invention Package structure and method for forming the same. A package structure and method for forming th...
Invention Tft with hydrogen absorption layer and method for forming the same. Various embodiments of the p...
Invention Integrated circuit (ic) device, ic layout, and method of generating ic layout. An IC device incl...
Invention Semiconductor device and forming method with channel feature thereof. A method includes forming ...
Invention Diffusion barrier structures in source/drain structures of nanostructure transistors. The presen...
Invention Method of increasing crosslinking density of photoresist. A lithography method includes the foll...
Invention Package structure and method of fabricating the same. A package structure includes a circuit sub...
Invention Semiconductor structure having thermal sensor and manufacturing method thereof. A semiconductor ...
Invention Package assembly and method of forming the same. A method of forming a package assembly includes...
Invention Integrated fiber array unit structure including embedded passive optical components and method fo...
Invention Package structure and manufacturing method thereof. A package structure includes a device struct...
Invention Thermal characterization method and manufacturing of semiconductor package. A thermal characteri...
Invention Inspection system and method for operating thereof. A method includes capturing a first referenc...
Invention Integrated circuit with noise reducing capacitor and method of manufacture. A capacitor is conne...
Invention Chip package structure and method for forming the same. A chip package structure is provided. Th...
Invention Package shuttle for enhanced package handling reliability and methods for forming the same. A pa...
2023 Invention Semiconductor devices and methods thereof with selectively formed isolation layers. Semiconducto...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
P/S Custom manufacture of semiconductors, computer memory chips, multiprocessor memory chips, semicon...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
2022 P/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...
P/S Semiconductors; semiconductor memory chips; semiconductor wafers; integrated circuits; electronic...