- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/012 - Soldering with the use of hot gas
Patent holdings for IPC class B23K 1/012
Total number of patents in this class: 110
10-year publication summary
|
10
|
10
|
8
|
4
|
4
|
8
|
9
|
6
|
4
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Illinois Tool Works Inc. | 11803 |
8 |
| Senju Metal Industry Co., Ltd. | 685 |
6 |
| ERSA GmbH | 67 |
5 |
| Yield Engineering SPV LLC | 30 |
4 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47782 |
3 |
| Samsung Electronics Co., Ltd. | 155524 |
2 |
| International Business Machines Corporation | 62353 |
2 |
| Hitachi, Ltd. | 15954 |
2 |
| Denso Corporation | 25379 |
2 |
| Daikin Industries, Ltd. | 10412 |
2 |
| Aleris Rolled Products Germany GmbH | 61 |
2 |
| Alpha Assembly Solutions Inc. | 211 |
2 |
| Kne Kabushiki Kaisha | 2 |
2 |
| Radyne Corporation | 38 |
2 |
| Saint-Gobain Sekurit France | 810 |
2 |
| SWEP International AB | 103 |
2 |
| Yield Engineering Systems, Inc. | 74 |
2 |
| Tesla, Inc. | 1933 |
2 |
| GE Infrastructure Technology, LLC | 6180 |
2 |
| Endress+Hauser SE+Co. KG | 566 |
2 |
| Other owners | 54 |