- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 101/40 - Semiconductor devices
Patent holdings for IPC class B23K 101/40
Total number of patents in this class: 1037
10-year publication summary
|
99
|
89
|
101
|
66
|
102
|
88
|
65
|
85
|
100
|
65
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1953 |
145 |
| Samsung Electronics Co., Ltd. | 156823 |
42 |
| Hamamatsu Photonics K.K. | 4644 |
38 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48073 |
28 |
| Kulicke and Soffa Industries, Inc. | 333 |
21 |
| Senju Metal Industry Co., Ltd. | 688 |
19 |
| Siltectra GmbH | 90 |
19 |
| Shinkawa Ltd. | 414 |
17 |
| Jsw Aktina System, Co., Ltd. | 83 |
16 |
| Samsung Display Co., Ltd. | 38400 |
15 |
| Applied Materials, Inc. | 20300 |
14 |
| Tokyo Electron Limited | 13722 |
13 |
| Nichia Corporation | 3866 |
13 |
| Micron Technology, Inc. | 27579 |
12 |
| Fuji Electric Co., Ltd. | 5449 |
12 |
| EO Technics Co., Ltd. | 114 |
11 |
| Kioxia Corporation | 10781 |
11 |
| Wolfspeed, Inc. | 892 |
10 |
| International Business Machines Corporation | 62517 |
9 |
| Texas Instruments Incorporated | 19660 |
9 |
| Other owners | 563 |