- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 101/40 - Semiconductor devices
Patent holdings for IPC class B23K 101/40
Total number of patents in this class: 919
10-year publication summary
|
63
|
99
|
89
|
101
|
65
|
99
|
79
|
50
|
73
|
84
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1886 |
115 |
| Hamamatsu Photonics K.K. | 4469 |
43 |
| Samsung Electronics Co., Ltd. | 148584 |
30 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44638 |
26 |
| Kulicke and Soffa Industries, Inc. | 311 |
20 |
| Senju Metal Industry Co., Ltd. | 685 |
18 |
| Shinkawa Ltd. | 425 |
17 |
| Siltectra GmbH | 88 |
17 |
| Jsw Aktina System, Co., Ltd. | 73 |
15 |
| Samsung Display Co., Ltd. | 35702 |
14 |
| Applied Materials, Inc. | 19087 |
14 |
| Fuji Electric Co., Ltd. | 5233 |
12 |
| Nichia Corporation | 3762 |
12 |
| Micron Technology, Inc. | 26365 |
11 |
| Tokyo Electron Limited | 13043 |
10 |
| Mitsubishi Electric Corporation | 46757 |
9 |
| Nippon Micrometal Corporation | 151 |
9 |
| Kioxia Corporation | 10453 |
9 |
| International Business Machines Corporation | 61651 |
8 |
| Infineon Technologies AG | 8271 |
8 |
| Other owners | 502 |