- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 5/02 - Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfacesAccessories therefor involving centres or chucks for holding work
Patent holdings for IPC class B24B 5/02
Total number of patents in this class: 35
10-year publication summary
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1
|
3
|
5
|
1
|
2
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1
|
1
|
2
|
3
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0
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| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Pratt & Whitney Canada Corp. | 5050 |
2 |
| JTEKT Corporation | 2540 |
2 |
| HASS Co., Ltd. | 64 |
2 |
| Mitsubishi Heavy Industries, Ltd. | 8951 |
1 |
| Applied Materials, Inc. | 19577 |
1 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46507 |
1 |
| Ebara Corporation | 2249 |
1 |
| JPMorgan Chase Bank, National Association | 8614 |
1 |
| Northwestern University | 3483 |
1 |
| Agathon AG Maschinenfabrik | 13 |
1 |
| Berger Holding GmbH & Co. KG | 8 |
1 |
| Disco Corporation | 1917 |
1 |
| Erwin Junker Grinding Technology A.S. | 24 |
1 |
| Erwin Junker Maschinenfabrik GmbH | 40 |
1 |
| FANUC Corporation | 6954 |
1 |
| Fritz Studer AG | 22 |
1 |
| K.C. Tech Co., Ltd. | 90 |
1 |
| MAHLE International GmbH | 2841 |
1 |
| MORI Seiki Co., Ltd. | 32 |
1 |
| Pilkington Group Limited | 774 |
1 |
| Other owners | 12 |