- All sections
- C - Chemistrymetallurgy
- C09G - Polishing compositionsski waxes
- C09G 1/02 - Polishing compositions containing abrasives or grinding agents
Patent holdings for IPC class C09G 1/02
Total number of patents in this class: 2221
10-year publication summary
|
157
|
160
|
187
|
210
|
200
|
192
|
191
|
195
|
191
|
27
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fujimi Incorporated | 771 |
332 |
| CMC Materials LLC | 246 |
125 |
| Anji Microelectronics (Shanghai) Co., Ltd. | 154 |
108 |
| Versum Materials US, LLC | 661 |
101 |
| Resonac Corporation | 3143 |
101 |
| FUJIFILM Electronic Materials U.S.A., Inc. | 341 |
77 |
| BASF SE | 21131 |
73 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46877 |
58 |
| Entegris, Inc. | 1958 |
57 |
| DuPont Electronic Materials Holding, Inc. | 206 |
51 |
| Anji Microelectronics Technology (Shanghai) Co., Ltd. | 58 |
41 |
| Cabot Microelectronics Corporation | 182 |
40 |
| JSR Corporation | 2556 |
35 |
| K.C. Tech Co., Ltd. | 92 |
35 |
| Saint-Gobain Ceramics & Plastics, Inc. | 807 |
35 |
| Samsung Electronics Co., Ltd. | 152534 |
27 |
| Rhodia Operations | 1537 |
27 |
| BASF (China) Co., Ltd. | 868 |
27 |
| FUJIFILM Corporation | 30137 |
25 |
| Shin-Etsu Chemical Co., Ltd. | 5893 |
25 |
| Other owners | 821 |