- All sections
- C - Chemistry; metallurgy
- C23C - Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general
- C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, i.e. electroless plating
Patent holdings for IPC class C23C 18/16
Total number of patents in this class: 1781
10-year publication summary
|
268
|
221
|
197
|
173
|
168
|
116
|
117
|
97
|
85
|
1
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Tokyo Electron Limited | 12067 |
88 |
| Atotech Deutschland GmbH | 566 |
73 |
| Lam Research Corporation | 4978 |
36 |
| Eastman Kodak Company | 3045 |
34 |
| C. Uyemura & Co., Ltd. | 163 |
22 |
| BYD Company Limited | 4273 |
19 |
| Rtx Corporation | 9069 |
17 |
| FUJIFILM Corporation | 28467 |
16 |
| Atotech Deutschland GmbH & Co. KG | 369 |
16 |
| Modumetal, Inc. | 71 |
14 |
| LG Chem, Ltd. | 17620 |
13 |
| Applied Materials, Inc. | 17676 |
12 |
| JX Nippon Mining & Metals Corporation | 1527 |
12 |
| MacDermid Enthone Inc. | 234 |
12 |
| Mitsubishi Electric Corporation | 44678 |
11 |
| Averatek Corporation | 34 |
11 |
| Industrial Technology Research Institute | 4962 |
10 |
| TDK Corporation | 6517 |
10 |
| Ebara Corporation | 2072 |
10 |
| DuPont Electronic Materials International, LLC | 365 |
10 |
| Other owners | 1335 |