- All sections
- C - Chemistrymetallurgy
- C23C - Coating metallic materialcoating material with metallic materialsurface treatment of metallic material by diffusion into the surface, by chemical conversion or substitutioncoating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general
- C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
Patent holdings for IPC class C23C 18/16
Total number of patents in this class: 1889
10-year publication summary
|
221
|
198
|
173
|
168
|
120
|
120
|
104
|
90
|
100
|
47
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Tokyo Electron Limited | 13987 |
88 |
| Atotech Deutschland GmbH | 522 |
73 |
| Eastman Kodak Company | 2564 |
39 |
| Lam Research Corporation | 5723 |
36 |
| Atotech Deutschland GmbH & Co. KG | 393 |
24 |
| C. Uyemura & Co., Ltd. | 163 |
23 |
| BYD Company Limited | 6662 |
19 |
| Rtx Corporation | 10222 |
17 |
| MacDermid Enthone Inc. | 255 |
15 |
| Modumetal, Inc. | 80 |
15 |
| FUJIFILM Corporation | 30808 |
14 |
| LG Chem, Ltd. | 17986 |
13 |
| Ebara Corporation | 2379 |
13 |
| Applied Materials, Inc. | 20625 |
12 |
| JX Nippon Mining & Metals Corporation | 1453 |
12 |
| DuPont Electronic Materials International, LLC | 431 |
12 |
| The Boeing Company | 20217 |
11 |
| Mitsubishi Electric Corporation | 48460 |
11 |
| Cuptronic Technology Ltd. | 12 |
11 |
| Industrial Technology Research Institute | 5200 |
10 |
| Other owners | 1421 |