- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/447 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups involving the application of pressure, e.g. thermo-compression bonding
Patent holdings for IPC class H01L 21/447
Total number of patents in this class: 55
10-year publication summary
|
4
|
6
|
4
|
6
|
11
|
7
|
3
|
1
|
4
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Micron Technology, Inc. | 26138 |
10 |
| Disco Corporation | 1867 |
9 |
| Applied Materials, Inc. | 18792 |
3 |
| Korea Institute of Machinery & Materials | 750 |
3 |
| The Regents of the University of California | 20015 |
2 |
| Semiconductor Energy Laboratory Co., Ltd. | 11456 |
2 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43064 |
2 |
| Mitsubishi Electric Corporation | 46295 |
2 |
| Tokyo Electron Limited | 12825 |
2 |
| Boe Technology Group Co., Ltd. | 41421 |
2 |
| Mikro Mesa Technology Co., Ltd. | 106 |
2 |
| Center for Advanced Meta-Materials | 145 |
2 |
| Toshiba Corporation | 12383 |
1 |
| SK Hynix Inc. | 11428 |
1 |
| Nikon Corporation | 7200 |
1 |
| Nitto Denko Corporation | 8271 |
1 |
| Dai Nippon Printing Co., Ltd. | 4104 |
1 |
| Innovative Micro Technology | 31 |
1 |
| Lumens Co., Ltd. | 268 |
1 |
| Mitsubishi Heavy Industries Machine Tool Co., Ltd. | 140 |
1 |
| Other owners | 6 |