• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/475 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layers using masks

Patent holdings for IPC class H01L 21/475

Total number of patents in this class: 69

10-year publication summary

6
7
13
7
3
6
4
3
1
0
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
47602
6
Semiconductor Energy Laboratory Co., Ltd.
11708
5
LG Innotek Co., Ltd.
8232
5
Boe Technology Group Co., Ltd.
43166
5
GLOBALFOUNDRIES U.S. Inc.
6397
4
Unisantis Electronics Singapore Pte. Ltd.
659
4
Samsung Display Co., Ltd.
37981
3
Infineon Technologies AG
8382
3
Hefei Xinsheng Optoelectronics Technology Co., Ltd.
2627
3
Samsung SDI Co., Ltd.
10047
2
MicroContinuum, Inc.
28
2
Semiconductor Manufacturing International (Shanghai) Corporation
1739
2
Samsung Electronics Co., Ltd.
154751
1
Texas Instruments Incorporated
19628
1
Texas Instruments Japan, Ltd.
1656
1
Renesas Electronics Corporation
5859
1
Ricoh Company, Ltd.
13303
1
Applied Materials, Inc.
20112
1
Tokyo Electron Limited
13577
1
SK Hynix Inc.
12212
1
Other owners 17