- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/475 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layers using masks
Patent holdings for IPC class H01L 21/475
Total number of patents in this class: 69
10-year publication summary
|
6
|
7
|
13
|
7
|
3
|
6
|
4
|
3
|
1
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
6 |
| Semiconductor Energy Laboratory Co., Ltd. | 11797 |
5 |
| LG Innotek Co., Ltd. | 8453 |
5 |
| Boe Technology Group Co., Ltd. | 44004 |
5 |
| GLOBALFOUNDRIES U.S. Inc. | 6391 |
4 |
| Unisantis Electronics Singapore Pte. Ltd. | 663 |
4 |
| Samsung Display Co., Ltd. | 38570 |
3 |
| Infineon Technologies AG | 8400 |
3 |
| Hefei Xinsheng Optoelectronics Technology Co., Ltd. | 2642 |
3 |
| Samsung SDI Co., Ltd. | 10556 |
2 |
| MicroContinuum, Inc. | 27 |
2 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1735 |
2 |
| Samsung Electronics Co., Ltd. | 157557 |
1 |
| Texas Instruments Incorporated | 19663 |
1 |
| Texas Instruments Japan, Ltd. | 1656 |
1 |
| Renesas Electronics Corporation | 5879 |
1 |
| Ricoh Company, Ltd. | 13346 |
1 |
| Applied Materials, Inc. | 20363 |
1 |
| Tokyo Electron Limited | 13796 |
1 |
| SK Hynix Inc. | 12452 |
1 |
| Other owners | 17 |