- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/475 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layers using masks
Patent holdings for IPC class H01L 21/475
Total number of patents in this class: 69
10-year publication summary
|
6
|
7
|
13
|
7
|
3
|
6
|
4
|
3
|
1
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47602 |
6 |
| Semiconductor Energy Laboratory Co., Ltd. | 11708 |
5 |
| LG Innotek Co., Ltd. | 8232 |
5 |
| Boe Technology Group Co., Ltd. | 43166 |
5 |
| GLOBALFOUNDRIES U.S. Inc. | 6397 |
4 |
| Unisantis Electronics Singapore Pte. Ltd. | 659 |
4 |
| Samsung Display Co., Ltd. | 37981 |
3 |
| Infineon Technologies AG | 8382 |
3 |
| Hefei Xinsheng Optoelectronics Technology Co., Ltd. | 2627 |
3 |
| Samsung SDI Co., Ltd. | 10047 |
2 |
| MicroContinuum, Inc. | 28 |
2 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1739 |
2 |
| Samsung Electronics Co., Ltd. | 154751 |
1 |
| Texas Instruments Incorporated | 19628 |
1 |
| Texas Instruments Japan, Ltd. | 1656 |
1 |
| Renesas Electronics Corporation | 5859 |
1 |
| Ricoh Company, Ltd. | 13303 |
1 |
| Applied Materials, Inc. | 20112 |
1 |
| Tokyo Electron Limited | 13577 |
1 |
| SK Hynix Inc. | 12212 |
1 |
| Other owners | 17 |