- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/4763 - Deposition of non-insulating-, e.g. conductive-, resistive-, layers on insulating layersAfter-treatment of these layers
Patent holdings for IPC class H01L 21/4763
Total number of patents in this class: 1968
10-year publication summary
|
156
|
93
|
58
|
61
|
34
|
13
|
13
|
4
|
4
|
4
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47518 |
284 |
| Samsung Electronics Co., Ltd. | 154406 |
141 |
| GLOBALFOUNDRIES U.S. Inc. | 6394 |
128 |
| International Business Machines Corporation | 62279 |
83 |
| Micron Technology, Inc. | 27314 |
69 |
| Renesas Electronics Corporation | 5861 |
52 |
| United Microelectronics Corp. | 4455 |
48 |
| Texas Instruments Incorporated | 19635 |
47 |
| Hynix Semiconductor Inc. | 1648 |
43 |
| Semiconductor Energy Laboratory Co., Ltd. | 11701 |
40 |
| SK Hynix Inc. | 12181 |
35 |
| Boe Technology Group Co., Ltd. | 43120 |
32 |
| Applied Materials, Inc. | 20085 |
31 |
| Kioxia Corporation | 10712 |
30 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1741 |
26 |
| Intel Corporation | 46700 |
25 |
| Macronix International Co., Ltd. | 2516 |
25 |
| Infineon Technologies AG | 8381 |
23 |
| Tokyo Electron Limited | 13561 |
23 |
| Shenzhen Xinguodu Technology Co., Ltd. | 2069 |
22 |
| Other owners | 761 |