- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
Patent holdings for IPC class H01L 21/48
Total number of patents in this class: 14124
10-year publication summary
|
1299
|
1322
|
1280
|
1393
|
1244
|
1305
|
1245
|
1394
|
1360
|
430
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47419 |
2307 |
| Intel Corporation | 46681 |
945 |
| Samsung Electronics Co., Ltd. | 154120 |
623 |
| Texas Instruments Incorporated | 19638 |
465 |
| Advanced Semiconductor Engineering, Inc. | 1706 |
385 |
| Infineon Technologies AG | 8383 |
303 |
| Qualcomm Incorporated | 90374 |
270 |
| International Business Machines Corporation | 62251 |
238 |
| Micron Technology, Inc. | 27310 |
221 |
| Semiconductor Components Industries, L.L.C. | 5269 |
215 |
| Amkor Technology Singapore Holding Pte. Ltd | 466 |
198 |
| STATS ChipPAC Pte. Lte. | 983 |
191 |
| Siliconware Precision Industries Co., Ltd. | 668 |
187 |
| Shinko Electric Industries Co., Ltd. | 1225 |
184 |
| NXP USA, Inc. | 4437 |
156 |
| Mitsubishi Electric Corporation | 47625 |
151 |
| Adeia Semiconductor Technologies LLC | 585 |
145 |
| Rohm Co., Ltd. | 6757 |
129 |
| Fuji Electric Co., Ltd. | 5394 |
129 |
| Renesas Electronics Corporation | 5866 |
102 |
| Other owners | 6580 |