- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
Patent holdings for IPC class H01L 21/56
Total number of patents in this class: 15707
10-year publication summary
|
1288
|
1427
|
1440
|
1446
|
1571
|
1421
|
1285
|
1269
|
1447
|
1170
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46161 |
3346 |
| Samsung Electronics Co., Ltd. | 149087 |
739 |
| Intel Corporation | 46460 |
520 |
| Texas Instruments Incorporated | 19495 |
511 |
| Infineon Technologies AG | 8287 |
441 |
| STATS ChipPAC Pte. Lte. | 1546 |
434 |
| Advanced Semiconductor Engineering, Inc. | 1679 |
379 |
| Micron Technology, Inc. | 26558 |
293 |
| Amkor Technology Singapore Holding Pte. Ltd | 439 |
250 |
| Siliconware Precision Industries Co., Ltd. | 624 |
238 |
| Semiconductor Components Industries, L.L.C. | 5297 |
227 |
| NXP USA, Inc. | 4350 |
190 |
| Mitsubishi Electric Corporation | 46926 |
179 |
| Rohm Co., Ltd. | 6560 |
170 |
| Qualcomm Incorporated | 87585 |
157 |
| Renesas Electronics Corporation | 5928 |
154 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 361 |
127 |
| Murata Manufacturing Co., Ltd. | 25001 |
123 |
| Amkor Technology Singapore Holding Pte.ltd. | 497 |
118 |
| International Business Machines Corporation | 61721 |
117 |
| Other owners | 6994 |