- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
Patent holdings for IPC class H01L 21/56
Total number of patents in this class: 16061
10-year publication summary
|
1427
|
1440
|
1446
|
1571
|
1422
|
1286
|
1264
|
1447
|
1227
|
325
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47211 |
3399 |
| Samsung Electronics Co., Ltd. | 153573 |
786 |
| Texas Instruments Incorporated | 19615 |
536 |
| Intel Corporation | 46638 |
524 |
| Infineon Technologies AG | 8383 |
451 |
| Advanced Semiconductor Engineering, Inc. | 1701 |
383 |
| STATS ChipPAC Pte. Lte. | 981 |
304 |
| Micron Technology, Inc. | 27266 |
301 |
| Amkor Technology Singapore Holding Pte. Ltd | 462 |
261 |
| Siliconware Precision Industries Co., Ltd. | 663 |
246 |
| Semiconductor Components Industries, L.L.C. | 5262 |
235 |
| NXP USA, Inc. | 4421 |
191 |
| Mitsubishi Electric Corporation | 47556 |
181 |
| Rohm Co., Ltd. | 6740 |
174 |
| Qualcomm Incorporated | 90109 |
167 |
| Renesas Electronics Corporation | 5871 |
157 |
| STATS ChipPAC Management Pte. Ltd. | 542 |
142 |
| Adeia Semiconductor Technologies LLC | 585 |
137 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 357 |
127 |
| Murata Manufacturing Co., Ltd. | 25506 |
125 |
| Other owners | 7234 |