- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Patent holdings for IPC class H01L 21/60
Total number of patents in this class: 5086
10-year publication summary
|
283
|
214
|
226
|
284
|
301
|
336
|
293
|
294
|
266
|
71
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Shinkawa Ltd. | 419 |
199 |
| Rohm Co., Ltd. | 6727 |
145 |
| Dexerials Corporation | 1990 |
128 |
| Panasonic Corporation | 19786 |
124 |
| Mitsubishi Electric Corporation | 47522 |
124 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47071 |
106 |
| Intel Corporation | 46673 |
105 |
| Hitachi Chemical Company, Ltd. | 2279 |
98 |
| Nippon Micrometal Corporation | 151 |
91 |
| Murata Manufacturing Co., Ltd. | 25464 |
87 |
| Panasonic Intellectual Property Management Co., Ltd. | 33401 |
76 |
| Toray Engineering Co., Ltd. | 510 |
70 |
| Texas Instruments Incorporated | 19614 |
69 |
| Sharp Kabushiki Kaisha | 18643 |
68 |
| Qualcomm Incorporated | 89928 |
67 |
| Sony Semiconductor Solutions Corporation | 11176 |
64 |
| Lintec Corporation | 2002 |
55 |
| Sekisui Chemical Co., Ltd. | 3577 |
55 |
| Nitto Denko Corporation | 8447 |
54 |
| Fuji Electric Co., Ltd. | 5373 |
53 |
| Other owners | 3248 |