- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Patent holdings for IPC class H01L 21/60
Total number of patents in this class: 5041
10-year publication summary
|
258
|
283
|
214
|
226
|
284
|
301
|
334
|
288
|
292
|
204
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Shinkawa Ltd. | 429 |
200 |
| Rohm Co., Ltd. | 6480 |
141 |
| Panasonic Corporation | 20050 |
126 |
| Dexerials Corporation | 1937 |
126 |
| Mitsubishi Electric Corporation | 46397 |
117 |
| Intel Corporation | 47143 |
110 |
| Hitachi Chemical Company, Ltd. | 2340 |
103 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43258 |
102 |
| Nippon Micrometal Corporation | 150 |
91 |
| Murata Manufacturing Co., Ltd. | 24713 |
87 |
| Sharp Kabushiki Kaisha | 18716 |
73 |
| Panasonic Intellectual Property Management Co., Ltd. | 31806 |
69 |
| Texas Instruments Incorporated | 19455 |
68 |
| Toray Engineering Co., Ltd. | 491 |
65 |
| Sony Semiconductor Solutions Corporation | 10599 |
61 |
| Qualcomm Incorporated | 86346 |
60 |
| Nitto Denko Corporation | 8280 |
53 |
| Sekisui Chemical Co., Ltd. | 3441 |
53 |
| Lintec Corporation | 1968 |
52 |
| Fuji Electric Co., Ltd. | 5194 |
51 |
| Other owners | 3233 |