- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/70 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereofManufacture of integrated circuit devices or of specific parts thereof
Patent holdings for IPC class H01L 21/70
Total number of patents in this class: 1405
10-year publication summary
|
120
|
89
|
71
|
59
|
48
|
24
|
22
|
11
|
13
|
3
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47518 |
205 |
| Samsung Electronics Co., Ltd. | 154406 |
86 |
| GLOBALFOUNDRIES U.S. Inc. | 6394 |
72 |
| International Business Machines Corporation | 62279 |
50 |
| Micron Technology, Inc. | 27314 |
49 |
| Texas Instruments Incorporated | 19635 |
46 |
| United Microelectronics Corp. | 4455 |
36 |
| Renesas Electronics Corporation | 5861 |
33 |
| Infineon Technologies AG | 8381 |
22 |
| Semiconductor Components Industries, L.L.C. | 5266 |
22 |
| Intel Corporation | 46700 |
20 |
| SK Hynix Inc. | 12181 |
18 |
| Qualcomm Incorporated | 90545 |
17 |
| Kioxia Corporation | 10712 |
17 |
| Macronix International Co., Ltd. | 2516 |
15 |
| Boe Technology Group Co., Ltd. | 43120 |
14 |
| Institute of Microelectronics, Chinese Academy of Sciences | 1437 |
14 |
| National Semiconductor Corporation | 886 |
12 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1741 |
12 |
| Texas Instruments Japan, Ltd. | 1656 |
11 |
| Other owners | 634 |