- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/70 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereofManufacture of integrated circuit devices or of specific parts thereof
Patent holdings for IPC class H01L 21/70
Total number of patents in this class: 1393
10-year publication summary
|
120
|
89
|
71
|
59
|
48
|
24
|
22
|
11
|
13
|
4
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48302 |
204 |
| Samsung Electronics Co., Ltd. | 157719 |
85 |
| GLOBALFOUNDRIES U.S. Inc. | 6387 |
72 |
| International Business Machines Corporation | 62634 |
50 |
| Micron Technology, Inc. | 27657 |
46 |
| Texas Instruments Incorporated | 19672 |
46 |
| United Microelectronics Corp. | 4492 |
36 |
| Renesas Electronics Corporation | 5870 |
33 |
| Infineon Technologies AG | 8402 |
22 |
| Semiconductor Components Industries, L.L.C. | 5262 |
21 |
| Intel Corporation | 47106 |
20 |
| SK Hynix Inc. | 12486 |
18 |
| Qualcomm Incorporated | 92196 |
17 |
| Kioxia Corporation | 10815 |
17 |
| Macronix International Co., Ltd. | 2494 |
15 |
| Boe Technology Group Co., Ltd. | 44029 |
14 |
| Institute of Microelectronics, Chinese Academy of Sciences | 1459 |
14 |
| National Semiconductor Corporation | 839 |
12 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1732 |
12 |
| Texas Instruments Japan, Ltd. | 1656 |
11 |
| Other owners | 628 |