- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/74 - Making of buried regions of high impurity concentration, e.g. buried collector layers, internal connections
Patent holdings for IPC class H01L 21/74
Total number of patents in this class: 684
10-year publication summary
50
|
39
|
74
|
67
|
54
|
75
|
76
|
72
|
57
|
19
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 43158 |
94 |
Monolithic 3D Inc. | 308 |
81 |
International Business Machines Corporation | 61402 |
39 |
Micron Technology, Inc. | 26164 |
30 |
Texas Instruments Incorporated | 19454 |
27 |
GLOBALFOUNDRIES U.S. Inc. | 6427 |
21 |
Renesas Electronics Corporation | 5988 |
20 |
Infineon Technologies AG | 8247 |
19 |
Samsung Electronics Co., Ltd. | 147334 |
18 |
Semiconductor Components Industries, L.L.C. | 5266 |
11 |
Qualcomm Incorporated | 86153 |
10 |
Vanguard International Semiconductor Corporation | 470 |
10 |
SK Hynix Inc. | 11438 |
8 |
QROMIS, Inc. | 96 |
8 |
Kioxia Corporation | 10346 |
8 |
STMicroelectronics (Rousset) SAS | 951 |
7 |
Infineon Technologies Austria AG | 2164 |
6 |
Tokyo Electron Limited | 12841 |
6 |
Murata Manufacturing Co., Ltd. | 24684 |
6 |
STMicroelectronics S.r.l. | 3608 |
6 |
Other owners | 249 |