- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/76 - Making of isolation regions between components
Patent holdings for IPC class H01L 21/76
Total number of patents in this class: 2204
10-year publication summary
|
145
|
151
|
144
|
114
|
107
|
129
|
103
|
50
|
33
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46560 |
290 |
| Samsung Electronics Co., Ltd. | 151303 |
109 |
| GLOBALFOUNDRIES U.S. Inc. | 6405 |
103 |
| Micron Technology, Inc. | 27172 |
90 |
| International Business Machines Corporation | 61906 |
71 |
| Applied Materials, Inc. | 19628 |
57 |
| United Microelectronics Corp. | 4385 |
53 |
| Sony Semiconductor Solutions Corporation | 11033 |
46 |
| Fuji Electric Co., Ltd. | 5314 |
44 |
| Rohm Co., Ltd. | 6675 |
42 |
| Tokyo Electron Limited | 13363 |
37 |
| Texas Instruments Incorporated | 19553 |
35 |
| Intel Corporation | 46579 |
32 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1745 |
26 |
| Renesas Electronics Corporation | 5894 |
25 |
| Kioxia Corporation | 10521 |
24 |
| SK Hynix Inc. | 11894 |
23 |
| Nanya Technology Corporation | 2739 |
23 |
| Sony Corporation | 30608 |
21 |
| Infineon Technologies AG | 8314 |
20 |
| Other owners | 1033 |