- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/76 - Making of isolation regions between components
Patent holdings for IPC class H01L 21/76
Total number of patents in this class: 2141
10-year publication summary
|
145
|
151
|
144
|
114
|
107
|
129
|
106
|
51
|
34
|
5
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48629 |
286 |
| Samsung Electronics Co., Ltd. | 158605 |
106 |
| GLOBALFOUNDRIES U.S. Inc. | 6385 |
102 |
| Micron Technology, Inc. | 27666 |
84 |
| International Business Machines Corporation | 62754 |
68 |
| Applied Materials, Inc. | 20514 |
52 |
| United Microelectronics Corp. | 4504 |
51 |
| Sony Semiconductor Solutions Corporation | 11764 |
46 |
| Fuji Electric Co., Ltd. | 5521 |
44 |
| Rohm Co., Ltd. | 6885 |
42 |
| Tokyo Electron Limited | 13884 |
34 |
| Texas Instruments Incorporated | 19639 |
33 |
| Intel Corporation | 47162 |
31 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1730 |
25 |
| Renesas Electronics Corporation | 5863 |
24 |
| Kioxia Corporation | 10879 |
24 |
| SK Hynix Inc. | 12611 |
23 |
| Nanya Technology Corporation | 2925 |
23 |
| Sony Corporation | 30097 |
21 |
| Infineon Technologies AG | 8410 |
20 |
| Other owners | 1002 |