• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology

Patent holdings for IPC class H01L 21/8252

Total number of patents in this class: 509

10-year publication summary

51
53
61
59
63
37
32
36
28
15
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Intel Corporation
46664
50
Taiwan Semiconductor Manufacturing Company, Ltd.
41951
46
International Business Machines Corporation
60806
18
Skyworks Solutions, Inc.
3658
18
Texas Instruments Incorporated
19473
17
Innoscience (Suzhou) Technology Co., ltd.
170
16
Murata Manufacturing Co., Ltd.
24260
14
QROMIS, Inc.
92
11
MACOM Technology Solutions Holdings, Inc.
816
10
Cambridge GaN Devices Limited
42
10
Samsung Electronics Co., Ltd.
143555
9
Qorvo US, Inc.
2187
9
Qualcomm Incorporated
84189
8
Efficient Power Conversion Corporation
130
8
GLOBALFOUNDRIES U.S. Inc.
6436
8
Mitsubishi Electric Corporation
45693
7
Raytheon Company
8396
7
United Microelectronics Corp.
4202
7
Commissariat à l'énergie atomique et aux energies alternatives
10810
6
Infineon Technologies Austria AG
2122
5
Other owners 225