• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology

Patent holdings for IPC class H01L 21/8252

Total number of patents in this class: 494

10-year publication summary

53
61
59
63
37
29
29
24
19
2
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Intel Corporation
46737
49
Taiwan Semiconductor Manufacturing Company, Ltd.
47734
42
Skyworks Solutions, Inc.
3900
18
International Business Machines Corporation
62325
17
Texas Instruments Incorporated
19636
17
Innoscience (Suzhou) Technology Co., ltd.
171
15
Murata Manufacturing Co., Ltd.
25590
14
MACOM Technology Solutions Holdings, Inc.
857
10
QROMIS, Inc.
97
10
Samsung Electronics Co., Ltd.
155224
9
GLOBALFOUNDRIES U.S. Inc.
6397
9
Qorvo US, Inc.
2381
9
Cambridge GaN Devices Limited
56
9
Qualcomm Incorporated
90870
8
Mitsubishi Electric Corporation
47722
8
Efficient Power Conversion Corporation
136
8
Raytheon Company
8467
7
United Microelectronics Corp.
4463
7
Commissariat à l'énergie atomique et aux energies alternatives
11021
6
Infineon Technologies Austria AG
2306
5
Other owners 217