- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
Patent holdings for IPC class H01L 21/8252
Total number of patents in this class: 488
10-year publication summary
|
53
|
61
|
59
|
63
|
37
|
28
|
29
|
20
|
19
|
1
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 47178 |
49 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48560 |
42 |
| Skyworks Solutions, Inc. | 3965 |
18 |
| International Business Machines Corporation | 62748 |
17 |
| Texas Instruments Incorporated | 19640 |
15 |
| Innoscience (Suzhou) Technology Co., ltd. | 171 |
15 |
| Murata Manufacturing Co., Ltd. | 25809 |
14 |
| MACOM Technology Solutions Holdings, Inc. | 859 |
10 |
| QROMIS, Inc. | 96 |
10 |
| Samsung Electronics Co., Ltd. | 158442 |
9 |
| Qorvo US, Inc. | 2405 |
9 |
| Cambridge GaN Devices Limited | 57 |
9 |
| Qualcomm Incorporated | 92859 |
8 |
| Mitsubishi Electric Corporation | 48172 |
8 |
| Efficient Power Conversion Corporation | 136 |
8 |
| Raytheon Company | 8436 |
7 |
| United Microelectronics Corp. | 4502 |
7 |
| GLOBALFOUNDRIES U.S. Inc. | 6380 |
7 |
| Commissariat à l'énergie atomique et aux energies alternatives | 11127 |
6 |
| Infineon Technologies Austria AG | 2345 |
5 |
| Other owners | 215 |