- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
Patent holdings for IPC class H01L 21/8252
Total number of patents in this class: 509
10-year publication summary
51
|
53
|
61
|
59
|
63
|
37
|
32
|
36
|
28
|
15
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Intel Corporation | 46664 |
50 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 41951 |
46 |
International Business Machines Corporation | 60806 |
18 |
Skyworks Solutions, Inc. | 3658 |
18 |
Texas Instruments Incorporated | 19473 |
17 |
Innoscience (Suzhou) Technology Co., ltd. | 170 |
16 |
Murata Manufacturing Co., Ltd. | 24260 |
14 |
QROMIS, Inc. | 92 |
11 |
MACOM Technology Solutions Holdings, Inc. | 816 |
10 |
Cambridge GaN Devices Limited | 42 |
10 |
Samsung Electronics Co., Ltd. | 143555 |
9 |
Qorvo US, Inc. | 2187 |
9 |
Qualcomm Incorporated | 84189 |
8 |
Efficient Power Conversion Corporation | 130 |
8 |
GLOBALFOUNDRIES U.S. Inc. | 6436 |
8 |
Mitsubishi Electric Corporation | 45693 |
7 |
Raytheon Company | 8396 |
7 |
United Microelectronics Corp. | 4202 |
7 |
Commissariat à l'énergie atomique et aux energies alternatives | 10810 |
6 |
Infineon Technologies Austria AG | 2122 |
5 |
Other owners | 225 |