• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/8258 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using a combination of technologies covered by , , or

Patent holdings for IPC class H01L 21/8258

Total number of patents in this class: 469

10-year publication summary

70
63
72
61
44
23
28
27
24
3
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Semiconductor Energy Laboratory Co., Ltd.
11416
60
Taiwan Semiconductor Manufacturing Company, Ltd.
42863
59
Intel Corporation
47013
52
International Business Machines Corporation
61287
33
Infineon Technologies Austria AG
2152
14
Samsung Electronics Co., Ltd.
146534
13
Semiconductor Components Industries, L.L.C.
5254
12
GLOBALFOUNDRIES U.S. Inc.
6430
12
Qualcomm Incorporated
85550
10
Raytheon Company
8387
10
IMEC VZW
1640
10
Infineon Technologies Americas Corp.
671
10
MACOM Technology Solutions Holdings, Inc.
817
10
Massachusetts Institute of Technology
10057
9
Texas Instruments Incorporated
19448
8
Semiconductor Manufacturing International (Shanghai) Corporation
1767
8
United Microelectronics Corp.
4230
7
Nanyang Technological University
2016
7
Efficient Power Conversion Corporation
130
6
Tahoe Research, Ltd.
1961
5
Other owners 114