- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/04 - ContainersSeals characterised by the shape
Patent holdings for IPC class H01L 23/04
Total number of patents in this class: 1422
10-year publication summary
|
130
|
122
|
140
|
111
|
97
|
92
|
72
|
73
|
62
|
54
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44095 |
117 |
| Kyocera Corporation | 13997 |
109 |
| Mitsubishi Electric Corporation | 46618 |
68 |
| International Business Machines Corporation | 61616 |
43 |
| Fuji Electric Co., Ltd. | 5220 |
40 |
| Advanced Semiconductor Engineering, Inc. | 1672 |
35 |
| Intel Corporation | 46921 |
34 |
| Samsung Electronics Co., Ltd. | 148077 |
32 |
| Micron Technology, Inc. | 26279 |
30 |
| Infineon Technologies AG | 8265 |
25 |
| Invensas Corporation | 613 |
24 |
| Murata Manufacturing Co., Ltd. | 24843 |
22 |
| Daishinku Corporation | 245 |
21 |
| STATS ChipPAC Pte. Lte. | 1551 |
21 |
| Amkor Technology Singapore Holding Pte.ltd. | 504 |
15 |
| BroadPak Corporation | 19 |
14 |
| Renesas Electronics Corporation | 5964 |
12 |
| Infineon Technologies Americas Corp. | 743 |
12 |
| Toshiba Corporation | 12514 |
11 |
| Xilinx, Inc. | 3968 |
11 |
| Other owners | 726 |