- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Patent holdings for IPC class H01L 23/10
Total number of patents in this class: 1522
10-year publication summary
|
106
|
139
|
137
|
104
|
86
|
88
|
87
|
84
|
88
|
55
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48861 |
162 |
| Mitsubishi Electric Corporation | 48351 |
72 |
| Intel Corporation | 46292 |
34 |
| Murata Manufacturing Co., Ltd. | 25917 |
32 |
| Fuji Electric Co., Ltd. | 5533 |
30 |
| Infineon Technologies AG | 8419 |
29 |
| Texas Instruments Incorporated | 19644 |
28 |
| Nippon Electric Glass Co., Ltd. | 2567 |
28 |
| Adeia Semiconductor Bonding Technologies Inc. | 615 |
27 |
| Samsung Electronics Co., Ltd. | 159029 |
24 |
| Kyocera Corporation | 14451 |
22 |
| Advanced Semiconductor Engineering, Inc. | 1761 |
22 |
| Raytheon Company | 8443 |
21 |
| International Business Machines Corporation | 62805 |
20 |
| Semiconductor Components Industries, L.L.C. | 5265 |
20 |
| STMicroelectronics International N.V. | 4239 |
18 |
| Rohm Co., Ltd. | 6908 |
16 |
| Qorvo US, Inc. | 2426 |
16 |
| Sony Semiconductor Solutions Corporation | 11858 |
16 |
| Adeia Semiconductor Technologies LLC | 596 |
14 |
| Other owners | 871 |