- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Patent holdings for IPC class H01L 23/10
Total number of patents in this class: 1502
10-year publication summary
113
|
106
|
138
|
136
|
104
|
86
|
89
|
88
|
87
|
61
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 43258 |
147 |
Mitsubishi Electric Corporation | 46397 |
73 |
Intel Corporation | 47143 |
34 |
Murata Manufacturing Co., Ltd. | 24713 |
34 |
Fuji Electric Co., Ltd. | 5194 |
28 |
Nippon Electric Glass Co., Ltd. | 2468 |
28 |
Samsung Electronics Co., Ltd. | 147501 |
25 |
Infineon Technologies AG | 8250 |
24 |
Texas Instruments Incorporated | 19455 |
23 |
Raytheon Company | 8393 |
22 |
Kyocera Corporation | 13909 |
22 |
Advanced Semiconductor Engineering, Inc. | 1664 |
22 |
International Business Machines Corporation | 61433 |
20 |
Semiconductor Components Industries, L.L.C. | 5269 |
20 |
Rohm Co., Ltd. | 6480 |
15 |
Denso Corporation | 24431 |
14 |
Qorvo US, Inc. | 2236 |
14 |
NXP USA, Inc. | 4304 |
14 |
Adeia Semiconductor Bonding Technologies Inc. | 362 |
14 |
Apple Inc. | 55387 |
13 |
Other owners | 896 |