- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Patent holdings for IPC class H01L 23/10
Total number of patents in this class: 1481
10-year publication summary
114
|
106
|
139
|
137
|
104
|
86
|
89
|
85
|
87
|
7
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 40608 |
141 |
Mitsubishi Electric Corporation | 44851 |
73 |
Murata Manufacturing Co., Ltd. | 23702 |
34 |
Intel Corporation | 46126 |
32 |
Fuji Electric Co., Ltd. | 4980 |
27 |
Nippon Electric Glass Co., Ltd. | 2396 |
27 |
Samsung Electronics Co., Ltd. | 139001 |
24 |
Texas Instruments Incorporated | 19432 |
23 |
Raytheon Company | 8444 |
22 |
Kyocera Corporation | 13344 |
22 |
Advanced Semiconductor Engineering, Inc. | 1596 |
21 |
International Business Machines Corporation | 60129 |
20 |
Semiconductor Components Industries, L.L.C. | 5246 |
20 |
Infineon Technologies AG | 8137 |
19 |
Denso Corporation | 23769 |
15 |
Qorvo US, Inc. | 2140 |
14 |
Apple Inc. | 52750 |
13 |
Rohm Co., Ltd. | 6346 |
13 |
Invensas Corporation | 621 |
13 |
STATS ChipPAC Pte. Lte. | 1534 |
13 |
Other owners | 895 |