- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/18 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
Patent holdings for IPC class H01L 23/18
Total number of patents in this class: 165
10-year publication summary
|
12
|
24
|
20
|
18
|
17
|
15
|
13
|
10
|
13
|
11
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43158 |
23 |
| Intel Corporation | 47093 |
14 |
| Samsung Electronics Co., Ltd. | 147334 |
12 |
| Infineon Technologies AG | 8247 |
10 |
| Texas Instruments Incorporated | 19454 |
7 |
| Micron Technology, Inc. | 26164 |
6 |
| Mitsubishi Electric Corporation | 46346 |
6 |
| Fuji Electric Co., Ltd. | 5174 |
4 |
| Advanced Semiconductor Engineering, Inc. | 1662 |
4 |
| Nanya Technology Corporation | 2522 |
4 |
| International Business Machines Corporation | 61402 |
3 |
| Amkor Technology Singapore Holding Pte.ltd. | 507 |
3 |
| 3m Innovative Properties Company | 17812 |
2 |
| Samsung Display Co., Ltd. | 35100 |
2 |
| Renesas Electronics Corporation | 5988 |
2 |
| Semiconductor Components Industries, L.L.C. | 5266 |
2 |
| Shinko Electric Industries Co., Ltd. | 1211 |
2 |
| The Board of Trustees of the University of Illinois | 2711 |
2 |
| ams International AG | 430 |
2 |
| Boe Technology Group Co., Ltd. | 41461 |
2 |
| Other owners | 53 |