- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/18 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
Patent holdings for IPC class H01L 23/18
Total number of patents in this class: 187
10-year publication summary
|
24
|
20
|
18
|
17
|
15
|
12
|
11
|
12
|
16
|
20
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 49677 |
28 |
| Intel Corporation | 46360 |
17 |
| Samsung Electronics Co., Ltd. | 159978 |
15 |
| Infineon Technologies AG | 8436 |
10 |
| Micron Technology, Inc. | 28001 |
6 |
| Texas Instruments Incorporated | 19641 |
6 |
| Mitsubishi Electric Corporation | 48546 |
6 |
| International Business Machines Corporation | 62897 |
4 |
| Fuji Electric Co., Ltd. | 5569 |
4 |
| Advanced Semiconductor Engineering, Inc. | 1765 |
4 |
| Nanya Technology Corporation | 2989 |
4 |
| Shinko Electric Industries Co., Ltd. | 1245 |
3 |
| Amkor Technology Singapore Holding Pte. Ltd | 498 |
3 |
| Amkor Technology Singapore Holding Pte.ltd. | 481 |
3 |
| 3m Innovative Properties Company | 17463 |
2 |
| Samsung Display Co., Ltd. | 39369 |
2 |
| Renesas Electronics Corporation | 5845 |
2 |
| Advanced Micro Devices, Inc. | 6166 |
2 |
| Semiconductor Components Industries, L.L.C. | 5262 |
2 |
| The Board of Trustees of the University of Illinois | 2769 |
2 |
| Other owners | 62 |