- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/367 - Cooling facilitated by shape of device
Patent holdings for IPC class H01L 23/367
Total number of patents in this class: 6718
10-year publication summary
|
504
|
603
|
663
|
661
|
655
|
621
|
595
|
712
|
759
|
81
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46560 |
648 |
| Intel Corporation | 46579 |
354 |
| Samsung Electronics Co., Ltd. | 151303 |
347 |
| Mitsubishi Electric Corporation | 47338 |
190 |
| International Business Machines Corporation | 61906 |
185 |
| Micron Technology, Inc. | 27172 |
131 |
| Infineon Technologies AG | 8314 |
112 |
| Huawei Technologies Co., Ltd. | 117973 |
112 |
| Fuji Electric Co., Ltd. | 5314 |
103 |
| Denso Corporation | 24991 |
98 |
| Qualcomm Incorporated | 88742 |
97 |
| Semiconductor Components Industries, L.L.C. | 5285 |
84 |
| Monolithic 3D Inc. | 324 |
73 |
| Rohm Co., Ltd. | 6675 |
67 |
| Advanced Semiconductor Engineering, Inc. | 1687 |
65 |
| Texas Instruments Incorporated | 19553 |
63 |
| NXP USA, Inc. | 4391 |
63 |
| Qorvo US, Inc. | 2326 |
59 |
| Siemens AG | 24286 |
55 |
| Murata Manufacturing Co., Ltd. | 25241 |
54 |
| Other owners | 3758 |