- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/367 - Cooling facilitated by shape of device
Patent holdings for IPC class H01L 23/367
Total number of patents in this class: 6889
10-year publication summary
|
505
|
604
|
665
|
662
|
658
|
619
|
591
|
698
|
758
|
306
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
688 |
| Samsung Electronics Co., Ltd. | 157557 |
365 |
| Intel Corporation | 47102 |
355 |
| Mitsubishi Electric Corporation | 47971 |
197 |
| International Business Machines Corporation | 62621 |
191 |
| Micron Technology, Inc. | 27626 |
131 |
| Huawei Technologies Co., Ltd. | 123282 |
116 |
| Infineon Technologies AG | 8400 |
112 |
| Fuji Electric Co., Ltd. | 5469 |
111 |
| Qualcomm Incorporated | 91997 |
102 |
| Denso Corporation | 25513 |
100 |
| Semiconductor Components Industries, L.L.C. | 5264 |
87 |
| Monolithic 3D Inc. | 332 |
73 |
| Advanced Semiconductor Engineering, Inc. | 1740 |
71 |
| Texas Instruments Incorporated | 19663 |
69 |
| Rohm Co., Ltd. | 6824 |
68 |
| NXP USA, Inc. | 4394 |
62 |
| Qorvo US, Inc. | 2394 |
60 |
| Siemens AG | 24033 |
56 |
| Siliconware Precision Industries Co., Ltd. | 686 |
56 |
| Other owners | 3819 |