- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/367 - Cooling facilitated by shape of device
Patent holdings for IPC class H01L 23/367
Total number of patents in this class: 6381
10-year publication summary
|
477
|
504
|
603
|
663
|
661
|
654
|
618
|
589
|
701
|
520
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43258 |
567 |
| Intel Corporation | 47143 |
361 |
| Samsung Electronics Co., Ltd. | 147501 |
320 |
| Mitsubishi Electric Corporation | 46397 |
185 |
| International Business Machines Corporation | 61433 |
179 |
| Micron Technology, Inc. | 26183 |
121 |
| Infineon Technologies AG | 8250 |
109 |
| Huawei Technologies Co., Ltd. | 113689 |
106 |
| Fuji Electric Co., Ltd. | 5194 |
97 |
| Denso Corporation | 24431 |
95 |
| Qualcomm Incorporated | 86346 |
87 |
| Semiconductor Components Industries, L.L.C. | 5269 |
77 |
| Monolithic 3D Inc. | 308 |
70 |
| Rohm Co., Ltd. | 6480 |
64 |
| Advanced Semiconductor Engineering, Inc. | 1664 |
63 |
| NXP USA, Inc. | 4304 |
63 |
| Texas Instruments Incorporated | 19455 |
58 |
| Murata Manufacturing Co., Ltd. | 24713 |
54 |
| Qorvo US, Inc. | 2236 |
54 |
| Siemens AG | 24409 |
53 |
| Other owners | 3598 |