- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/367 - Cooling facilitated by shape of device
Patent holdings for IPC class H01L 23/367
Total number of patents in this class: 6872
10-year publication summary
|
506
|
605
|
665
|
662
|
658
|
620
|
597
|
714
|
760
|
247
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47602 |
681 |
| Samsung Electronics Co., Ltd. | 154751 |
364 |
| Intel Corporation | 46718 |
356 |
| Mitsubishi Electric Corporation | 47683 |
197 |
| International Business Machines Corporation | 62295 |
189 |
| Micron Technology, Inc. | 27348 |
131 |
| Huawei Technologies Co., Ltd. | 120888 |
116 |
| Infineon Technologies AG | 8382 |
113 |
| Fuji Electric Co., Ltd. | 5409 |
109 |
| Qualcomm Incorporated | 90674 |
102 |
| Denso Corporation | 25283 |
100 |
| Semiconductor Components Industries, L.L.C. | 5276 |
83 |
| Monolithic 3D Inc. | 331 |
74 |
| Rohm Co., Ltd. | 6772 |
69 |
| Advanced Semiconductor Engineering, Inc. | 1713 |
69 |
| Texas Instruments Incorporated | 19628 |
68 |
| NXP USA, Inc. | 4444 |
63 |
| Qorvo US, Inc. | 2380 |
59 |
| Siemens AG | 24177 |
56 |
| Siliconware Precision Industries Co., Ltd. | 671 |
56 |
| Other owners | 3817 |