- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/367 - Cooling facilitated by shape of device
Patent holdings for IPC class H01L 23/367
Total number of patents in this class: 6572
10-year publication summary
|
477
|
504
|
603
|
663
|
661
|
655
|
620
|
591
|
710
|
700
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46069 |
637 |
| Intel Corporation | 46445 |
348 |
| Samsung Electronics Co., Ltd. | 148924 |
331 |
| Mitsubishi Electric Corporation | 46870 |
189 |
| International Business Machines Corporation | 61734 |
182 |
| Micron Technology, Inc. | 26502 |
124 |
| Huawei Technologies Co., Ltd. | 115556 |
111 |
| Infineon Technologies AG | 8279 |
110 |
| Fuji Electric Co., Ltd. | 5243 |
100 |
| Denso Corporation | 24755 |
96 |
| Qualcomm Incorporated | 87475 |
93 |
| Semiconductor Components Industries, L.L.C. | 5296 |
83 |
| Monolithic 3D Inc. | 316 |
72 |
| Rohm Co., Ltd. | 6553 |
67 |
| Advanced Semiconductor Engineering, Inc. | 1674 |
64 |
| NXP USA, Inc. | 4347 |
64 |
| Texas Instruments Incorporated | 19493 |
59 |
| Qorvo US, Inc. | 2285 |
57 |
| Murata Manufacturing Co., Ltd. | 24971 |
54 |
| Siemens AG | 24337 |
53 |
| Other owners | 3678 |