- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Patent holdings for IPC class H01L 23/48
Total number of patents in this class: 16049
10-year publication summary
|
1181
|
1075
|
993
|
960
|
994
|
907
|
920
|
973
|
1137
|
596
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42636 |
2434 |
| Samsung Electronics Co., Ltd. | 145864 |
1325 |
| Intel Corporation | 46962 |
863 |
| Micron Technology, Inc. | 26258 |
516 |
| International Business Machines Corporation | 61210 |
392 |
| STATS ChipPAC Pte. Lte. | 1553 |
268 |
| Infineon Technologies AG | 8219 |
266 |
| Mitsubishi Electric Corporation | 46037 |
262 |
| Renesas Electronics Corporation | 6014 |
243 |
| Rohm Co., Ltd. | 6444 |
239 |
| Texas Instruments Incorporated | 19468 |
223 |
| GLOBALFOUNDRIES U.S. Inc. | 6430 |
215 |
| Qualcomm Incorporated | 85183 |
208 |
| SK Hynix Inc. | 11326 |
207 |
| Kioxia Corporation | 10289 |
197 |
| Advanced Semiconductor Engineering, Inc. | 1648 |
170 |
| Invensas Corporation | 613 |
146 |
| Nanya Technology Corporation | 2449 |
132 |
| Changxin Memory Technologies, Inc. | 4927 |
124 |
| Semiconductor Components Industries, L.L.C. | 5252 |
122 |
| Other owners | 7497 |