- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Patent holdings for IPC class H01L 23/48
Total number of patents in this class: 16425
10-year publication summary
|
1074
|
991
|
956
|
993
|
905
|
925
|
1000
|
1162
|
1058
|
134
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46560 |
2614 |
| Samsung Electronics Co., Ltd. | 151303 |
1389 |
| Intel Corporation | 46579 |
855 |
| Micron Technology, Inc. | 27172 |
527 |
| International Business Machines Corporation | 61906 |
413 |
| Mitsubishi Electric Corporation | 47338 |
263 |
| Infineon Technologies AG | 8314 |
257 |
| Rohm Co., Ltd. | 6675 |
251 |
| Qualcomm Incorporated | 88742 |
225 |
| Renesas Electronics Corporation | 5894 |
218 |
| Texas Instruments Incorporated | 19553 |
215 |
| SK Hynix Inc. | 11894 |
213 |
| GLOBALFOUNDRIES U.S. Inc. | 6405 |
213 |
| Kioxia Corporation | 10521 |
198 |
| Advanced Semiconductor Engineering, Inc. | 1687 |
174 |
| STATS ChipPAC Pte. Lte. | 986 |
154 |
| Nanya Technology Corporation | 2739 |
150 |
| Fuji Electric Co., Ltd. | 5314 |
128 |
| Changxin Memory Technologies, Inc. | 4924 |
125 |
| Sony Corporation | 30608 |
119 |
| Other owners | 7724 |