- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
Patent holdings for IPC class H01L 23/488
Total number of patents in this class: 987
10-year publication summary
|
76
|
91
|
66
|
81
|
74
|
70
|
51
|
62
|
28
|
13
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47319 |
84 |
| Intel Corporation | 46680 |
53 |
| Huawei Technologies Co., Ltd. | 120098 |
49 |
| Changxin Memory Technologies, Inc. | 4924 |
25 |
| International Business Machines Corporation | 62220 |
20 |
| Boe Technology Group Co., Ltd. | 42957 |
20 |
| Samsung Electronics Co., Ltd. | 153845 |
17 |
| Texas Instruments Incorporated | 19631 |
17 |
| Siemens AG | 24200 |
13 |
| Mitsubishi Electric Corporation | 47602 |
11 |
| Advanced Semiconductor Engineering, Inc. | 1703 |
10 |
| Infineon Technologies AG | 8377 |
9 |
| Rohm Co., Ltd. | 6747 |
9 |
| ATI Technologies ULC | 1590 |
9 |
| China Wafer Level CSP Co., Ltd. | 66 |
9 |
| Apple Inc. | 58074 |
8 |
| Murata Manufacturing Co., Ltd. | 25514 |
8 |
| Shinko Electric Industries Co., Ltd. | 1224 |
8 |
| STATS ChipPAC Pte. Lte. | 981 |
8 |
| Semiconductor Components Industries, L.L.C. | 5260 |
7 |
| Other owners | 593 |