- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
Patent holdings for IPC class H01L 23/49
Total number of patents in this class: 884
10-year publication summary
|
65
|
76
|
98
|
89
|
67
|
75
|
57
|
50
|
61
|
35
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 158842 |
42 |
| Intel Corporation | 46449 |
39 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48760 |
36 |
| Advanced Semiconductor Engineering, Inc. | 1755 |
28 |
| Texas Instruments Incorporated | 19639 |
25 |
| Fuji Electric Co., Ltd. | 5526 |
24 |
| Infineon Technologies AG | 8418 |
18 |
| Mitsubishi Electric Corporation | 48287 |
18 |
| Rohm Co., Ltd. | 6898 |
18 |
| Micron Technology, Inc. | 27726 |
17 |
| Semiconductor Components Industries, L.L.C. | 5261 |
13 |
| Invensas Corporation | 207 |
12 |
| Adeia Semiconductor Technologies LLC | 595 |
12 |
| Siliconware Precision Industries Co., Ltd. | 700 |
11 |
| Boe Technology Group Co., Ltd. | 44549 |
9 |
| Heraeus Materials Singapore, PTE., Ltd. | 44 |
9 |
| Amkor Technology Singapore Holding Pte. Ltd | 487 |
9 |
| Toshiba Corporation | 12660 |
8 |
| Renesas Electronics Corporation | 5860 |
8 |
| Huawei Technologies Co., Ltd. | 124630 |
8 |
| Other owners | 520 |