- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
Patent holdings for IPC class H01L 23/52
Total number of patents in this class: 5070
10-year publication summary
|
340
|
295
|
274
|
265
|
164
|
127
|
103
|
77
|
29
|
9
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46560 |
566 |
| Samsung Electronics Co., Ltd. | 151303 |
301 |
| Micron Technology, Inc. | 27172 |
171 |
| Renesas Electronics Corporation | 5894 |
134 |
| Intel Corporation | 46579 |
123 |
| Infineon Technologies AG | 8314 |
119 |
| Panasonic Corporation | 19882 |
113 |
| International Business Machines Corporation | 61906 |
109 |
| GLOBALFOUNDRIES U.S. Inc. | 6405 |
102 |
| Texas Instruments Incorporated | 19553 |
81 |
| Kioxia Corporation | 10521 |
74 |
| STATS ChipPAC Pte. Lte. | 986 |
70 |
| SK Hynix Inc. | 11894 |
68 |
| Advanced Semiconductor Engineering, Inc. | 1687 |
56 |
| Qualcomm Incorporated | 88742 |
55 |
| Tokyo Electron Limited | 13363 |
51 |
| STATS ChipPAC Management Pte. Ltd. | 559 |
51 |
| Amkor Technology Singapore Holding Pte.ltd. | 496 |
47 |
| Tahoe Research, Ltd. | 2136 |
47 |
| Rohm Co., Ltd. | 6675 |
43 |
| Other owners | 2689 |