- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
Patent holdings for IPC class H01L 23/52
Total number of patents in this class: 5215
10-year publication summary
|
334
|
341
|
296
|
277
|
266
|
163
|
123
|
88
|
57
|
16
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42549 |
567 |
| Samsung Electronics Co., Ltd. | 145630 |
305 |
| Micron Technology, Inc. | 26258 |
179 |
| Renesas Electronics Corporation | 6020 |
151 |
| Intel Corporation | 46960 |
134 |
| STATS ChipPAC Pte. Lte. | 1552 |
130 |
| Infineon Technologies AG | 8218 |
123 |
| Panasonic Corporation | 20128 |
114 |
| International Business Machines Corporation | 61198 |
106 |
| GLOBALFOUNDRIES U.S. Inc. | 6427 |
103 |
| Texas Instruments Incorporated | 19479 |
90 |
| Kioxia Corporation | 10285 |
75 |
| SK Hynix Inc. | 11307 |
66 |
| Qualcomm Incorporated | 85094 |
58 |
| Advanced Semiconductor Engineering, Inc. | 1645 |
57 |
| Tokyo Electron Limited | 12681 |
52 |
| Rohm Co., Ltd. | 6433 |
48 |
| Amkor Technology Singapore Holding Pte.ltd. | 508 |
47 |
| Invensas Corporation | 614 |
42 |
| Tahoe Research, Ltd. | 1969 |
42 |
| Other owners | 2726 |