- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
Patent holdings for IPC class H01L 23/52
Total number of patents in this class: 4948
10-year publication summary
|
340
|
295
|
275
|
265
|
164
|
129
|
106
|
99
|
32
|
21
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
566 |
| Samsung Electronics Co., Ltd. | 157557 |
299 |
| Micron Technology, Inc. | 27626 |
165 |
| Renesas Electronics Corporation | 5879 |
129 |
| Intel Corporation | 47102 |
127 |
| Infineon Technologies AG | 8400 |
116 |
| International Business Machines Corporation | 62621 |
106 |
| Panasonic Corporation | 19060 |
106 |
| GLOBALFOUNDRIES U.S. Inc. | 6391 |
101 |
| Texas Instruments Incorporated | 19663 |
73 |
| Kioxia Corporation | 10805 |
73 |
| STATS ChipPAC Pte. Lte. | 976 |
69 |
| SK Hynix Inc. | 12452 |
68 |
| Qualcomm Incorporated | 91997 |
54 |
| Advanced Semiconductor Engineering, Inc. | 1740 |
54 |
| STATS ChipPAC Management Pte. Ltd. | 545 |
50 |
| Tokyo Electron Limited | 13796 |
46 |
| Tahoe Research, Ltd. | 2032 |
46 |
| Amkor Technology Singapore Holding Pte.ltd. | 485 |
45 |
| Rohm Co., Ltd. | 6824 |
41 |
| Other owners | 2614 |