- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
Patent holdings for IPC class H01L 23/522
Total number of patents in this class: 16434
10-year publication summary
|
1336
|
1343
|
1491
|
1704
|
1669
|
1570
|
1580
|
1635
|
1566
|
317
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47071 |
4246 |
| Samsung Electronics Co., Ltd. | 153093 |
1396 |
| Intel Corporation | 46673 |
854 |
| International Business Machines Corporation | 62148 |
836 |
| Micron Technology, Inc. | 27238 |
485 |
| Qualcomm Incorporated | 89928 |
403 |
| Kioxia Corporation | 10704 |
361 |
| SK Hynix Inc. | 12086 |
320 |
| Sony Semiconductor Solutions Corporation | 11176 |
316 |
| Sandisk Technologies Inc. | 5344 |
298 |
| GLOBALFOUNDRIES U.S. Inc. | 6398 |
291 |
| Renesas Electronics Corporation | 5873 |
250 |
| Texas Instruments Incorporated | 19614 |
225 |
| Nanya Technology Corporation | 2831 |
216 |
| United Microelectronics Corp. | 4425 |
207 |
| Yangtze Memory Technologies Co., Ltd. | 3124 |
187 |
| Rohm Co., Ltd. | 6727 |
138 |
| Changxin Memory Technologies, Inc. | 4924 |
104 |
| Adeia Semiconductor Solutions LLC | 758 |
104 |
| Tokyo Electron Limited | 13465 |
101 |
| Other owners | 5096 |