- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
Patent holdings for IPC class H01L 23/522
Total number of patents in this class: 15705
10-year publication summary
|
1057
|
1336
|
1343
|
1491
|
1704
|
1669
|
1570
|
1564
|
1627
|
1160
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43854 |
3939 |
| Samsung Electronics Co., Ltd. | 147983 |
1338 |
| Intel Corporation | 47239 |
861 |
| International Business Machines Corporation | 61596 |
795 |
| Micron Technology, Inc. | 26255 |
448 |
| Qualcomm Incorporated | 86867 |
384 |
| Kioxia Corporation | 10439 |
355 |
| SK Hynix Inc. | 11526 |
310 |
| Sony Semiconductor Solutions Corporation | 10700 |
309 |
| Sandisk Technologies Inc. | 4868 |
289 |
| GLOBALFOUNDRIES U.S. Inc. | 6409 |
289 |
| Renesas Electronics Corporation | 5969 |
252 |
| Texas Instruments Incorporated | 19456 |
211 |
| Nanya Technology Corporation | 2581 |
205 |
| United Microelectronics Corp. | 4256 |
193 |
| Yangtze Memory Technologies Co., Ltd. | 2765 |
179 |
| Rohm Co., Ltd. | 6511 |
136 |
| Changxin Memory Technologies, Inc. | 4928 |
104 |
| Tokyo Electron Limited | 12994 |
98 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1754 |
94 |
| Other owners | 4916 |