- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/528 - Layout of the interconnection structure
Patent holdings for IPC class H01L 23/528
Total number of patents in this class: 14036
10-year publication summary
|
1448
|
1201
|
1192
|
1275
|
1311
|
1315
|
1452
|
1622
|
1690
|
453
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47419 |
3183 |
| Samsung Electronics Co., Ltd. | 154120 |
1687 |
| International Business Machines Corporation | 62251 |
932 |
| Micron Technology, Inc. | 27310 |
660 |
| Intel Corporation | 46681 |
649 |
| Kioxia Corporation | 10709 |
478 |
| SK Hynix Inc. | 12171 |
407 |
| Nanya Technology Corporation | 2857 |
285 |
| Qualcomm Incorporated | 90374 |
281 |
| GLOBALFOUNDRIES U.S. Inc. | 6392 |
252 |
| Sandisk Technologies Inc. | 5375 |
248 |
| Yangtze Memory Technologies Co., Ltd. | 3172 |
239 |
| United Microelectronics Corp. | 4452 |
185 |
| Changxin Memory Technologies, Inc. | 4924 |
171 |
| Renesas Electronics Corporation | 5866 |
166 |
| Texas Instruments Incorporated | 19638 |
122 |
| Macronix International Co., Ltd. | 2518 |
120 |
| Adeia Semiconductor Solutions LLC | 758 |
109 |
| Socionext Inc. | 1589 |
102 |
| Infineon Technologies AG | 8383 |
81 |
| Other owners | 3679 |