- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
Patent holdings for IPC class H01L 23/535
Total number of patents in this class: 2810
10-year publication summary
|
412
|
351
|
308
|
253
|
247
|
324
|
308
|
209
|
156
|
56
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48861 |
618 |
| Samsung Electronics Co., Ltd. | 159029 |
357 |
| International Business Machines Corporation | 62805 |
212 |
| Micron Technology, Inc. | 27793 |
140 |
| GLOBALFOUNDRIES U.S. Inc. | 6390 |
126 |
| Intel Corporation | 46292 |
79 |
| United Microelectronics Corp. | 4522 |
73 |
| Kioxia Corporation | 11017 |
71 |
| SK Hynix Inc. | 12667 |
70 |
| Yangtze Memory Technologies Co., Ltd. | 3400 |
61 |
| Renesas Electronics Corporation | 5855 |
47 |
| Nanya Technology Corporation | 2961 |
46 |
| Sandisk Technologies Inc. | 5485 |
41 |
| Qualcomm Incorporated | 93376 |
32 |
| Macronix International Co., Ltd. | 2487 |
32 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1731 |
32 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1031 |
25 |
| Texas Instruments Incorporated | 19644 |
22 |
| Rohm Co., Ltd. | 6908 |
22 |
| Adeia Semiconductor Solutions LLC | 760 |
22 |
| Other owners | 682 |