- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
Patent holdings for IPC class H01L 25/00
Total number of patents in this class: 9677
10-year publication summary
858
|
907
|
930
|
874
|
943
|
883
|
916
|
840
|
940
|
389
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 42036 |
2212 |
Samsung Electronics Co., Ltd. | 143812 |
579 |
Intel Corporation | 46678 |
549 |
Micron Technology, Inc. | 26196 |
491 |
Murata Manufacturing Co., Ltd. | 24302 |
191 |
Kioxia Corporation | 10268 |
168 |
International Business Machines Corporation | 60907 |
160 |
Yangtze Memory Technologies Co., Ltd. | 2576 |
157 |
Qualcomm Incorporated | 84335 |
116 |
Invensas Corporation | 614 |
114 |
STATS ChipPAC Pte. Lte. | 1544 |
109 |
Sandisk Technologies Inc. | 4824 |
105 |
SK Hynix Inc. | 11200 |
102 |
Nanya Technology Corporation | 2365 |
100 |
Monolithic 3D Inc. | 308 |
98 |
Infineon Technologies AG | 8190 |
95 |
Texas Instruments Incorporated | 19493 |
91 |
Advanced Semiconductor Engineering, Inc. | 1634 |
91 |
Semiconductor Components Industries, L.L.C. | 5243 |
89 |
Xilinx, Inc. | 4017 |
85 |
Other owners | 3975 |