- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
Patent holdings for IPC class H01L 27/02
Total number of patents in this class: 8889
10-year publication summary
|
921
|
985
|
967
|
1012
|
886
|
735
|
661
|
664
|
619
|
38
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40608 |
1385 |
| Samsung Electronics Co., Ltd. | 139001 |
632 |
| Qualcomm Incorporated | 81865 |
263 |
| Texas Instruments Incorporated | 19432 |
260 |
| Boe Technology Group Co., Ltd. | 38881 |
257 |
| Intel Corporation | 46126 |
224 |
| Renesas Electronics Corporation | 6148 |
194 |
| GLOBALFOUNDRIES U.S. Inc. | 6433 |
186 |
| Micron Technology, Inc. | 25824 |
179 |
| United Microelectronics Corp. | 4106 |
179 |
| Infineon Technologies AG | 8137 |
145 |
| International Business Machines Corporation | 60129 |
142 |
| Socionext Inc. | 1553 |
139 |
| Rohm Co., Ltd. | 6346 |
104 |
| Changxin Memory Technologies, Inc. | 4924 |
101 |
| Semiconductor Components Industries, L.L.C. | 5246 |
98 |
| Semiconductor Energy Laboratory Co., Ltd. | 11101 |
92 |
| Monolithic 3D Inc. | 299 |
92 |
| NXP USA, Inc. | 4221 |
87 |
| SK Hynix Inc. | 10800 |
82 |
| Other owners | 4048 |