- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
Patent holdings for IPC class H01L 27/02
Total number of patents in this class: 8840
10-year publication summary
|
984
|
967
|
1011
|
880
|
722
|
624
|
561
|
512
|
279
|
27
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46735 |
1362 |
| Samsung Electronics Co., Ltd. | 152016 |
634 |
| Qualcomm Incorporated | 89126 |
275 |
| Texas Instruments Incorporated | 19574 |
258 |
| Boe Technology Group Co., Ltd. | 42636 |
253 |
| Intel Corporation | 46594 |
221 |
| GLOBALFOUNDRIES U.S. Inc. | 6400 |
183 |
| United Microelectronics Corp. | 4410 |
182 |
| Renesas Electronics Corporation | 5887 |
177 |
| Micron Technology, Inc. | 27215 |
176 |
| International Business Machines Corporation | 62002 |
157 |
| Infineon Technologies AG | 8332 |
144 |
| Socionext Inc. | 1583 |
132 |
| Rohm Co., Ltd. | 6695 |
102 |
| Semiconductor Components Industries, L.L.C. | 5282 |
99 |
| Changxin Memory Technologies, Inc. | 4924 |
98 |
| NXP USA, Inc. | 4404 |
91 |
| Monolithic 3D Inc. | 326 |
89 |
| Semiconductor Energy Laboratory Co., Ltd. | 11617 |
88 |
| SK Hynix Inc. | 11969 |
83 |
| Other owners | 4036 |