- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
Patent holdings for IPC class H01L 27/02
Total number of patents in this class: 8734
10-year publication summary
|
984
|
967
|
1011
|
880
|
718
|
616
|
528
|
477
|
264
|
43
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48302 |
1339 |
| Samsung Electronics Co., Ltd. | 157719 |
626 |
| Qualcomm Incorporated | 92196 |
272 |
| Texas Instruments Incorporated | 19672 |
258 |
| Boe Technology Group Co., Ltd. | 44029 |
252 |
| Intel Corporation | 47106 |
219 |
| GLOBALFOUNDRIES U.S. Inc. | 6387 |
181 |
| United Microelectronics Corp. | 4492 |
177 |
| Renesas Electronics Corporation | 5870 |
176 |
| Micron Technology, Inc. | 27657 |
171 |
| International Business Machines Corporation | 62634 |
158 |
| Infineon Technologies AG | 8402 |
142 |
| Socionext Inc. | 1595 |
131 |
| Rohm Co., Ltd. | 6826 |
99 |
| Semiconductor Components Industries, L.L.C. | 5262 |
97 |
| Changxin Memory Technologies, Inc. | 4933 |
97 |
| NXP USA, Inc. | 4401 |
90 |
| Monolithic 3D Inc. | 335 |
89 |
| Semiconductor Energy Laboratory Co., Ltd. | 11821 |
88 |
| SK Hynix Inc. | 12486 |
83 |
| Other owners | 3989 |