- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
Patent holdings for IPC class H01L 27/02
Total number of patents in this class: 8973
10-year publication summary
|
921
|
984
|
967
|
1011
|
883
|
730
|
645
|
641
|
586
|
235
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42804 |
1394 |
| Samsung Electronics Co., Ltd. | 146346 |
645 |
| Qualcomm Incorporated | 85434 |
274 |
| Texas Instruments Incorporated | 19460 |
259 |
| Boe Technology Group Co., Ltd. | 41217 |
255 |
| Intel Corporation | 47005 |
229 |
| GLOBALFOUNDRIES U.S. Inc. | 6432 |
192 |
| Renesas Electronics Corporation | 6009 |
184 |
| Micron Technology, Inc. | 26238 |
181 |
| United Microelectronics Corp. | 4229 |
181 |
| International Business Machines Corporation | 61257 |
150 |
| Infineon Technologies AG | 8225 |
146 |
| Socionext Inc. | 1549 |
135 |
| Rohm Co., Ltd. | 6459 |
103 |
| Changxin Memory Technologies, Inc. | 4926 |
100 |
| Semiconductor Components Industries, L.L.C. | 5249 |
97 |
| Monolithic 3D Inc. | 308 |
91 |
| Semiconductor Energy Laboratory Co., Ltd. | 11416 |
90 |
| NXP USA, Inc. | 4297 |
90 |
| SK Hynix Inc. | 11368 |
83 |
| Other owners | 4094 |