• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 27/07 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common

Patent holdings for IPC class H01L 27/07

Total number of patents in this class: 951

10-year publication summary

81
80
109
147
119
86
62
59
51
26
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Fuji Electric Co., Ltd.
5114
116
Taiwan Semiconductor Manufacturing Company, Ltd.
42222
78
Denso Corporation
24146
36
Rohm Co., Ltd.
6410
35
Infineon Technologies AG
8201
34
Toshiba Corporation
12300
33
Mitsubishi Electric Corporation
45860
33
International Business Machines Corporation
61123
31
Infineon Technologies Austria AG
2137
27
Texas Instruments Incorporated
19482
25
Micron Technology, Inc.
26214
24
Semiconductor Components Industries, L.L.C.
5253
22
Samsung Electronics Co., Ltd.
144426
19
Intel Corporation
46751
18
Toshiba Electronic Devices & Storage Corporation
1926
18
NXP USA, Inc.
4281
17
Qualcomm Incorporated
84634
14
Renesas Electronics Corporation
6054
13
Semiconductor Energy Laboratory Co., Ltd.
11371
13
GLOBALFOUNDRIES U.S. Inc.
6427
9
Other owners 336