- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/07 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
Patent holdings for IPC class H01L 27/07
Total number of patents in this class: 951
10-year publication summary
81
|
80
|
109
|
147
|
119
|
86
|
62
|
59
|
51
|
26
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Fuji Electric Co., Ltd. | 5114 |
116 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 42222 |
78 |
Denso Corporation | 24146 |
36 |
Rohm Co., Ltd. | 6410 |
35 |
Infineon Technologies AG | 8201 |
34 |
Toshiba Corporation | 12300 |
33 |
Mitsubishi Electric Corporation | 45860 |
33 |
International Business Machines Corporation | 61123 |
31 |
Infineon Technologies Austria AG | 2137 |
27 |
Texas Instruments Incorporated | 19482 |
25 |
Micron Technology, Inc. | 26214 |
24 |
Semiconductor Components Industries, L.L.C. | 5253 |
22 |
Samsung Electronics Co., Ltd. | 144426 |
19 |
Intel Corporation | 46751 |
18 |
Toshiba Electronic Devices & Storage Corporation | 1926 |
18 |
NXP USA, Inc. | 4281 |
17 |
Qualcomm Incorporated | 84634 |
14 |
Renesas Electronics Corporation | 6054 |
13 |
Semiconductor Energy Laboratory Co., Ltd. | 11371 |
13 |
GLOBALFOUNDRIES U.S. Inc. | 6427 |
9 |
Other owners | 336 |