• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 27/07 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common

Patent holdings for IPC class H01L 27/07

Total number of patents in this class: 948

10-year publication summary

81
80
109
147
119
86
62
55
50
31
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Fuji Electric Co., Ltd.
5160
114
Taiwan Semiconductor Manufacturing Company, Ltd.
42945
78
Denso Corporation
24355
36
Rohm Co., Ltd.
6471
35
Infineon Technologies AG
8224
34
Mitsubishi Electric Corporation
46197
34
Toshiba Corporation
12367
33
International Business Machines Corporation
61305
31
Infineon Technologies Austria AG
2153
27
Texas Instruments Incorporated
19443
25
Micron Technology, Inc.
26264
24
Semiconductor Components Industries, L.L.C.
5255
22
Samsung Electronics Co., Ltd.
146811
19
Intel Corporation
47033
19
Toshiba Electronic Devices & Storage Corporation
1982
18
NXP USA, Inc.
4304
17
Qualcomm Incorporated
85833
14
Renesas Electronics Corporation
6006
14
Semiconductor Energy Laboratory Co., Ltd.
11428
13
GLOBALFOUNDRIES U.S. Inc.
6426
9
Other owners 332