- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/082 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
Patent holdings for IPC class H01L 27/082
Total number of patents in this class: 360
10-year publication summary
38
|
45
|
33
|
31
|
21
|
24
|
17
|
20
|
17
|
5
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Murata Manufacturing Co., Ltd. | 24444 |
43 |
Texas Instruments Incorporated | 19494 |
25 |
GLOBALFOUNDRIES U.S. Inc. | 6429 |
18 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 42389 |
17 |
International Business Machines Corporation | 61185 |
15 |
Infineon Technologies AG | 8209 |
14 |
Fuji Electric Co., Ltd. | 5126 |
12 |
Renesas Electronics Corporation | 6046 |
9 |
Rohm Co., Ltd. | 6429 |
8 |
Samsung Electronics Co., Ltd. | 145025 |
7 |
Toshiba Corporation | 12317 |
7 |
Alpha and Omega Semiconductor Incorporated | 456 |
7 |
Skyworks Solutions, Inc. | 3708 |
7 |
NXP USA, Inc. | 4299 |
7 |
Micron Technology, Inc. | 26209 |
6 |
Infineon Technologies Austria AG | 2139 |
6 |
Qualcomm Incorporated | 84847 |
5 |
Semiconductor Components Industries, L.L.C. | 5252 |
5 |
Qorvo US, Inc. | 2203 |
5 |
STMicroelectronics (Crolles 2) SAS | 648 |
5 |
Other owners | 132 |