- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/082 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
Patent holdings for IPC class H01L 27/082
Total number of patents in this class: 335
10-year publication summary
|
45
|
33
|
31
|
21
|
23
|
17
|
16
|
17
|
3
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 25785 |
41 |
| Texas Instruments Incorporated | 19636 |
25 |
| GLOBALFOUNDRIES U.S. Inc. | 6384 |
18 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48539 |
17 |
| International Business Machines Corporation | 62742 |
14 |
| Infineon Technologies AG | 8410 |
12 |
| Fuji Electric Co., Ltd. | 5503 |
12 |
| Toshiba Corporation | 12584 |
7 |
| Renesas Electronics Corporation | 5862 |
7 |
| Rohm Co., Ltd. | 6846 |
7 |
| Alpha and Omega Semiconductor Incorporated | 444 |
7 |
| Skyworks Solutions, Inc. | 3966 |
7 |
| NXP USA, Inc. | 4403 |
7 |
| Qualcomm Incorporated | 92725 |
6 |
| Micron Technology, Inc. | 27709 |
6 |
| Infineon Technologies Austria AG | 2343 |
6 |
| Semiconductor Components Industries, L.L.C. | 5261 |
6 |
| Samsung Electronics Co., Ltd. | 158337 |
5 |
| Qorvo US, Inc. | 2411 |
5 |
| STMicroelectronics (Crolles 2) SAS | 625 |
5 |
| Other owners | 115 |