- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/088 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
Patent holdings for IPC class H01L 27/088
Total number of patents in this class: 10454
10-year publication summary
|
1057
|
1058
|
1042
|
1162
|
843
|
791
|
667
|
785
|
561
|
115
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
2925 |
| Samsung Electronics Co., Ltd. | 157557 |
987 |
| International Business Machines Corporation | 62621 |
817 |
| Semiconductor Energy Laboratory Co., Ltd. | 11797 |
581 |
| Intel Corporation | 47102 |
571 |
| GLOBALFOUNDRIES U.S. Inc. | 6391 |
447 |
| United Microelectronics Corp. | 4492 |
249 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1735 |
180 |
| Adeia Semiconductor Solutions LLC | 760 |
137 |
| Renesas Electronics Corporation | 5879 |
129 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1031 |
126 |
| Texas Instruments Incorporated | 19663 |
124 |
| Sony Semiconductor Solutions Corporation | 11551 |
109 |
| Qualcomm Incorporated | 91997 |
104 |
| Fuji Electric Co., Ltd. | 5469 |
91 |
| Micron Technology, Inc. | 27626 |
90 |
| Rohm Co., Ltd. | 6824 |
72 |
| Institute of Microelectronics, Chinese Academy of Sciences | 1459 |
72 |
| Socionext Inc. | 1596 |
67 |
| Infineon Technologies AG | 8400 |
65 |
| Other owners | 2511 |