- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/102 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components
Patent holdings for IPC class H01L 27/102
Total number of patents in this class: 409
10-year publication summary
39
|
54
|
40
|
44
|
32
|
19
|
9
|
5
|
4
|
3
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Micron Technology, Inc. | 26235 |
53 |
Zeno Semiconductor, Inc. | 250 |
47 |
SanDisk 3D LLC | 268 |
44 |
Samsung Electronics Co., Ltd. | 147787 |
17 |
TC Lab, Inc. | 31 |
14 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 43628 |
10 |
Nantero, Inc. | 167 |
10 |
Murata Manufacturing Co., Ltd. | 24813 |
9 |
SK Hynix Inc. | 11498 |
8 |
Macronix International Co., Ltd. | 2548 |
7 |
Ovonyx Memory Technology, LLC | 407 |
7 |
Kioxia Corporation | 10445 |
7 |
Texas Instruments Incorporated | 19462 |
6 |
Sandisk Technologies Inc. | 4863 |
6 |
Renesas Electronics Corporation | 5983 |
5 |
Attopsemi Technology Co., Ltd | 69 |
5 |
GLOBALFOUNDRIES U.S. Inc. | 6413 |
5 |
Infineon Technologies AG | 8255 |
4 |
Rohm Co., Ltd. | 6508 |
4 |
HangZhou HaiCun Information Technology Co., Ltd. | 46 |
4 |
Other owners | 137 |