- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/102 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components
Patent holdings for IPC class H01L 27/102
Total number of patents in this class: 386
10-year publication summary
|
54
|
40
|
44
|
32
|
19
|
9
|
4
|
4
|
2
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Micron Technology, Inc. | 27793 |
53 |
| Zeno Semiconductor, Inc. | 236 |
47 |
| SanDisk 3D LLC | 244 |
37 |
| Samsung Electronics Co., Ltd. | 159029 |
16 |
| TC Lab, Inc. | 31 |
14 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48861 |
9 |
| SK Hynix Inc. | 12667 |
8 |
| Macronix International Co., Ltd. | 2487 |
7 |
| Ovonyx Memory Technology, LLC | 367 |
7 |
| Kioxia Corporation | 11017 |
7 |
| Texas Instruments Incorporated | 19644 |
6 |
| Murata Manufacturing Co., Ltd. | 25917 |
6 |
| Semiconductor Components Industries, L.L.C. | 5265 |
6 |
| Sandisk Technologies Inc. | 5485 |
6 |
| Attopsemi Technology Co., Ltd | 71 |
5 |
| GLOBALFOUNDRIES U.S. Inc. | 6390 |
5 |
| Renesas Electronics Corporation | 5855 |
4 |
| Infineon Technologies AG | 8419 |
4 |
| Rohm Co., Ltd. | 6908 |
4 |
| Industry-University Cooperation Foundation Hanyang University | 1009 |
4 |
| Other owners | 131 |