- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/118 - Masterslice integrated circuits
Patent holdings for IPC class H01L 27/118
Total number of patents in this class: 1155
10-year publication summary
|
89
|
113
|
155
|
139
|
105
|
131
|
84
|
101
|
99
|
33
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43400 |
257 |
| Samsung Electronics Co., Ltd. | 147622 |
162 |
| Qualcomm Incorporated | 86553 |
88 |
| Socionext Inc. | 1559 |
75 |
| Monolithic 3D Inc. | 308 |
68 |
| Texas Instruments Incorporated | 19445 |
25 |
| International Business Machines Corporation | 61471 |
23 |
| Micron Technology, Inc. | 26210 |
22 |
| Semiconductor Energy Laboratory Co., Ltd. | 11481 |
22 |
| GLOBALFOUNDRIES U.S. Inc. | 6415 |
20 |
| Sony Corporation | 30929 |
16 |
| Intel Corporation | 47129 |
15 |
| Renesas Electronics Corporation | 5987 |
14 |
| Rohm Co., Ltd. | 6487 |
13 |
| Edico Genome, Corp. | 41 |
13 |
| Schottky Lsi, Inc. | 22 |
12 |
| Advanced Micro Devices, Inc. | 5705 |
11 |
| SK Hynix Inc. | 11484 |
8 |
| PDF Solutions, Inc. | 128 |
8 |
| Kioxia Corporation | 10441 |
8 |
| Other owners | 275 |