- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/118 - Masterslice integrated circuits
Patent holdings for IPC class H01L 27/118
Total number of patents in this class: 1162
10-year publication summary
|
90
|
113
|
155
|
140
|
105
|
132
|
89
|
109
|
109
|
3
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40608 |
255 |
| Samsung Electronics Co., Ltd. | 139001 |
161 |
| Qualcomm Incorporated | 81865 |
83 |
| Socionext Inc. | 1553 |
82 |
| Monolithic 3D Inc. | 299 |
69 |
| Texas Instruments Incorporated | 19432 |
25 |
| Semiconductor Energy Laboratory Co., Ltd. | 11101 |
24 |
| International Business Machines Corporation | 60129 |
23 |
| Micron Technology, Inc. | 25824 |
22 |
| Renesas Electronics Corporation | 6148 |
20 |
| GLOBALFOUNDRIES U.S. Inc. | 6433 |
17 |
| Sony Corporation | 31541 |
16 |
| Intel Corporation | 46126 |
15 |
| Edico Genome, Corp. | 44 |
14 |
| Rohm Co., Ltd. | 6346 |
13 |
| Advanced Micro Devices, Inc. | 5473 |
11 |
| Schottky Lsi, Inc. | 19 |
11 |
| SK Hynix Inc. | 10800 |
8 |
| Altera Corporation | 2183 |
8 |
| United Microelectronics Corp. | 4106 |
8 |
| Other owners | 277 |